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374724B00035G

374724B00035G Boyd Laconia, LLC


Board-Level-Cooling-3747.pdf Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 925 Stücke:

Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+13.52 EUR
10+ 13.15 EUR
672+ 10.31 EUR
Mindestbestellmenge: 2
Produktrezensionen
Produktbewertung abgeben

Technische Details 374724B00035G Boyd Laconia, LLC

Description: HEATSINK BGA 35X35X18MM W/ADH, Packaging: Bulk, Material: Aluminum, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.30°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.

Weitere Produktangebote 374724B00035G nach Preis ab 10.48 EUR bis 13.75 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
374724B00035G 374724B00035G Hersteller : Aavid Aavid_Boyd_Board_Level_Heatsinks_Catalog-3043646.pdf Heat Sinks Heat Sink for Plastic BGA Packages, Black, 35x35x18mm, IC Pkg=35 x 35, Tape #35
auf Bestellung 1613 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
4+13.75 EUR
10+ 13.39 EUR
25+ 13.03 EUR
50+ 12.3 EUR
100+ 11.6 EUR
250+ 10.84 EUR
500+ 10.48 EUR
Mindestbestellmenge: 4
374724B00035G 374724B00035G Hersteller : Aavid Thermalloy board-level-cooling-3747.pdf Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3C/W Black Anodized
Produkt ist nicht verfügbar
374724B00035G Hersteller : BOYD CORP Board-Level-Cooling-3747.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Application: BGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 18mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374724B00035G Hersteller : BOYD CORP Board-Level-Cooling-3747.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Application: BGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 18mm
Produkt ist nicht verfügbar