374724B60024G Boyd Corporation
Hersteller: Boyd CorporationHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
auf Bestellung 4339 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 115+ | 1.32 EUR |
| 116+ | 1.22 EUR |
| 120+ | 1.14 EUR |
| 1000+ | 1.08 EUR |
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Technische Details 374724B60024G Boyd Corporation
Description: HEATSINK BGA W/O SOLDER ANCHORS, Packaging: Bulk, Material: Aluminum, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Solder Anchor, Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.30°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 374724B60024G nach Preis ab 1.03 EUR bis 16.67 EUR
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374724B60024G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized |
auf Bestellung 4339 Stücke: Lieferzeit 14-21 Tag (e) |
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374724B60024G | Hersteller : Aavid |
Heat Sinks Heat Sink with BGA Solder Anchor, 35x35x18mm, Black, 2 Anchors, IC Pkg=35 x 35 |
auf Bestellung 1049 Stücke: Lieferzeit 14-28 Tag (e) |
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374724B60024G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 856 Stücke: Lieferzeit 21-28 Tag (e) |
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374724B60024G | Hersteller : Aavid Thermalloy |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3C/W Black Anodized |
auf Bestellung 168 Stücke: Lieferzeit 14-21 Tag (e) |
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| 374724B60024G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm Colour: black Material: aluminium Height: 18mm Length: 35mm Application: BGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Width: 35mm Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| 374724B60024G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm Colour: black Material: aluminium Height: 18mm Length: 35mm Application: BGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Width: 35mm |
Produkt ist nicht verfügbar |