374924B00032G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1091 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
4+ | 7.77 EUR |
10+ | 7.57 EUR |
390+ | 6.13 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 374924B00032G Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.575" (40.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.575" (40.01mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 4.0W @ 80°C, Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 20.30°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 374924B00032G nach Preis ab 5.51 EUR bis 7.83 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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374924B00032G | Hersteller : Aavid | Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black, 40x40x10mm, IC=40x40, Tape #32 |
auf Bestellung 2025 Stücke: Lieferzeit 14-28 Tag (e) |
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374924B00032G | Hersteller : Boyd Corporation | Heat Sink Passive BGA Pin Array Tape Aluminum 20.3°C/W Black Anodized |
Produkt ist nicht verfügbar |
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374924B00032G | Hersteller : Aavid Thermalloy | Heat Sink Passive BGA Pin Array Black Anodized |
Produkt ist nicht verfügbar |
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374924B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded Type of heatsink: extruded Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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374924B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded Type of heatsink: extruded |
Produkt ist nicht verfügbar |