
40-0518-11H Aries Electronics
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 17.2 EUR |
10+ | 15.49 EUR |
25+ | 14.57 EUR |
50+ | 11.07 EUR |
250+ | 11.04 EUR |
500+ | 10.65 EUR |
1000+ | 10.08 EUR |
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Technische Details 40-0518-11H Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 40 (1 x 40), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Weitere Produktangebote 40-0518-11H
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
---|---|---|---|---|---|
40-0518-11H | Hersteller : Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 40 (1 x 40) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
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