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40-0518-11H

40-0518-11H Aries Electronics

12020_single_dual_row_solder_pin_tails_collet_socket.pdf
Hersteller: Aries Electronics
IC & Component Sockets DUAL ROW COLLET SOLDER TAIL 40 PINS
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+27.5 EUR
10+24.38 EUR
25+23.45 EUR
50+22.51 EUR
100+21.25 EUR
250+19.37 EUR
500+18.14 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 40-0518-11H Aries Electronics

Description: CONN SOCKET SIP 40POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 40 (1 x 40), Type: SIP, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.

Weitere Produktangebote 40-0518-11H

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
40-0518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (1 x 40)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 57 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-0518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (1 x 40)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 57 Stücke
Im Einkaufswagen  Stück im Wert von  UAH