40-C182-10 Aries Electronics
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 15.93 EUR |
| 10+ | 13.53 EUR |
| 25+ | 12.67 EUR |
| 50+ | 12.07 EUR |
| 100+ | 11.46 EUR |
| 250+ | 10.75 EUR |
| 500+ | 10.26 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 40-C182-10 Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 40-C182-10 nach Preis ab 14.63 EUR bis 18.20 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
40-C182-10 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
40-C182-10 | Hersteller : ARIES |
Description: ARIES - 40-C182-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, EJECT-A-DIP, 15.24 mm, Berylliumkupfer tariffCode: 85369010 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP-Sockel rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 40Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: EJECT-A-DIP SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 50 Stücke: Lieferzeit 14-21 Tag (e) |