40-C182-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.49 EUR |
| 10+ | 18.27 EUR |
| 25+ | 17.11 EUR |
| 50+ | 16.29 EUR |
| 100+ | 14.6 EUR |
| 250+ | 14.36 EUR |
Artikel auf Bestellung
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Lieferzeit:
10-14 Tag (e)
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Produktbewertung abgeben
Technische Details 40-C182-10 Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 40-C182-10 nach Preis ab 17.41 EUR bis 45.76 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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40-C182-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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40-C182-10 | ARIES |
Description: ARIES - 40-C182-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, EJECT-A-DIP, 15.24 mm, Berylliumkupfer tariffCode: 85369010 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 40Kontakt(e) SVHC: No SVHC (15-Jan-2018) Reihenabstand: 15.24mm Steckverbinder: DIP-Sockel Produktpalette: EJECT-A-DIP productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 14 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 40-C182-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.66 EUR |
| 10+ | 19.49 EUR |
| 25+ | 18.36 EUR |
| 50+ | 17.89 EUR |
| 100+ | 17.41 EUR |
| 40-C182-10 |
|
Hersteller: ARIES
Description: ARIES - 40-C182-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, EJECT-A-DIP, 15.24 mm, Berylliumkupfer
tariffCode: 85369010
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 40Kontakt(e)
SVHC: No SVHC (15-Jan-2018)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: EJECT-A-DIP
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 40-C182-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, EJECT-A-DIP, 15.24 mm, Berylliumkupfer
tariffCode: 85369010
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 40Kontakt(e)
SVHC: No SVHC (15-Jan-2018)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: EJECT-A-DIP
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 14 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 45.76 EUR |
| 10+ | 31.61 EUR |