40-C182-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.49 EUR |
| 10+ | 18.27 EUR |
| 25+ | 17.11 EUR |
| 50+ | 16.29 EUR |
| 100+ | 14.6 EUR |
| 250+ | 14.36 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 40-C182-10 Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 40 (2 x 20), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 40-C182-10 nach Preis ab 17.41 EUR bis 21.66 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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40-C182-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 40POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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40-C182-10 | ARIES |
Description: ARIES - 40-C182-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, EJECT-A-DIP, 15.24 mm, Berylliumkupfer tariffCode: 85369010 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 40Kontakt(e) SVHC: No SVHC (15-Jan-2018) Reihenabstand: 15.24mm Steckverbinder: DIP-Sockel Produktpalette: EJECT-A-DIP productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 33 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 40-C182-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.66 EUR |
| 10+ | 19.49 EUR |
| 25+ | 18.36 EUR |
| 50+ | 17.89 EUR |
| 100+ | 17.41 EUR |
| 40-C182-10 |
|
Hersteller: ARIES
Description: ARIES - 40-C182-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, EJECT-A-DIP, 15.24 mm, Berylliumkupfer
tariffCode: 85369010
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 40Kontakt(e)
SVHC: No SVHC (15-Jan-2018)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: EJECT-A-DIP
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 40-C182-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, EJECT-A-DIP, 15.24 mm, Berylliumkupfer
tariffCode: 85369010
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 40Kontakt(e)
SVHC: No SVHC (15-Jan-2018)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: EJECT-A-DIP
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 33 Stücke:
Lieferzeit 14-21 Tag (e)