Technische Details 48-6553-11 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD, Termination: Solder, Number of Positions or Pins (Grid): 48 (2 x 24), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 48-6553-11
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| 48-6553-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 48POS GLDTermination: Solder Number of Positions or Pins (Grid): 48 (2 x 24) Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Contact Material - Post: Beryllium Copper Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 18 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 48-6553-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 18 Stücke
Im Einkaufswagen
Stück im Wert von UAH


