51632 QOLTEC
Hersteller: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 5g
Type of chemical agent: heat transfer paste
Colour: white
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.42W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 5g
Thermal resistance: max. 0.249°C/W
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 5g
Type of chemical agent: heat transfer paste
Colour: white
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.42W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 5g
Thermal resistance: max. 0.249°C/W
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 17.88 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 51632 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 5g, Type of chemical agent: heat transfer paste, Colour: white, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 1.42W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 5g, Thermal resistance: max. 0.249°C/W.