51633 QOLTEC
Hersteller: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g
Colour: white
Operating temperature: -30...280°C
Agent features: easy aplication; perfect insulation; thermally conductive
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Type of chemical agent: heat transfer paste
Kind of package: syringe
Thermal resistance: max. 0.249°C/W
Thermal conductivity: 1.42W/mK
Net weight: 30g
Anzahl je Verpackung: 1 Stücke
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g
Colour: white
Operating temperature: -30...280°C
Agent features: easy aplication; perfect insulation; thermally conductive
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Type of chemical agent: heat transfer paste
Kind of package: syringe
Thermal resistance: max. 0.249°C/W
Thermal conductivity: 1.42W/mK
Net weight: 30g
Anzahl je Verpackung: 1 Stücke
auf Bestellung 151 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 22+ | 3.4 EUR |
| 23+ | 3.2 EUR |
| 24+ | 2.99 EUR |
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Technische Details 51633 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g, Colour: white, Operating temperature: -30...280°C, Agent features: easy aplication; perfect insulation; thermally conductive, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Type of chemical agent: heat transfer paste, Kind of package: syringe, Thermal resistance: max. 0.249°C/W, Thermal conductivity: 1.42W/mK, Net weight: 30g, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote 51633 nach Preis ab 2.99 EUR bis 3.4 EUR
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51633 | Hersteller : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g Colour: white Operating temperature: -30...280°C Agent features: easy aplication; perfect insulation; thermally conductive Application: filling joints and micro-gaps between the processor and the base of the cooling system Type of chemical agent: heat transfer paste Kind of package: syringe Thermal resistance: max. 0.249°C/W Thermal conductivity: 1.42W/mK Net weight: 30g |
auf Bestellung 151 Stücke: Lieferzeit 14-21 Tag (e) |
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