51633 QOLTEC
Hersteller: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g
Type of chemical agent: heat transfer paste
Colour: white
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.42W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 30g
Operating temperature: -30...280°C
Thermal resistance: max. 0.249°C/W
Anzahl je Verpackung: 1 Stücke
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g
Type of chemical agent: heat transfer paste
Colour: white
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.42W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 30g
Operating temperature: -30...280°C
Thermal resistance: max. 0.249°C/W
Anzahl je Verpackung: 1 Stücke
auf Bestellung 111 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 22+ | 3.36 EUR |
| 23+ | 3.17 EUR |
| 25+ | 2.96 EUR |
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Technische Details 51633 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g, Type of chemical agent: heat transfer paste, Colour: white, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 1.42W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 30g, Operating temperature: -30...280°C, Thermal resistance: max. 0.249°C/W, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote 51633 nach Preis ab 2.96 EUR bis 3.36 EUR
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51633 | Hersteller : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g Type of chemical agent: heat transfer paste Colour: white Agent features: easy aplication; perfect insulation; thermally conductive Thermal conductivity: 1.42W/mK Kind of package: syringe Application: filling joints and micro-gaps between the processor and the base of the cooling system Net weight: 30g Operating temperature: -30...280°C Thermal resistance: max. 0.249°C/W |
auf Bestellung 111 Stücke: Lieferzeit 14-21 Tag (e) |
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