51638 QOLTEC
Hersteller: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; grey; 1.93W/mK; max.0.225°C/W; 30g
Type of chemical agent: heat transfer paste
Colour: grey
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.93W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 30g
Thermal resistance: max. 0.225°C/W
Category: Heat conductive compounds
Description: Heat transfer paste; grey; 1.93W/mK; max.0.225°C/W; 30g
Type of chemical agent: heat transfer paste
Colour: grey
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.93W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 30g
Thermal resistance: max. 0.225°C/W
auf Bestellung 17 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 15+ | 4.86 EUR |
| 16+ | 4.62 EUR |
| 17+ | 4.32 EUR |
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Technische Details 51638 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; grey; 1.93W/mK; max.0.225°C/W; 30g, Type of chemical agent: heat transfer paste, Colour: grey, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 1.93W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 30g, Thermal resistance: max. 0.225°C/W.