Hersteller: JST Sales America Inc.
Description: CONN HEADER SMD R/A 1POS 1.2MM
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): 2A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 1
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Male Blade
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Natural
Contact Finish - Mating: Gold
Contact Shape: Rectangular
Insulation Height: 0.055" (1.40mm)
Shrouding: Shrouded - 3 Wall
Insulation Material: Thermoplastic

Hersteller: LUMBERG
Description: LUMBERG - KV60 - Audio-/Video-Steckverbinder, DIN, 6 Kontakt(e), Buchse, Kabelmontage, Lötanschluss
tariffCode: 85366990
productTraceability: No
Kontaktüberzug: Versilberte Kontakte
rohsCompliant: YES
Ausführung: Buchse
Anzahl der Kontakte: 6Kontakt(e)
euEccn: NLR
Kontaktanschluss: Lötanschluss
Steckverbindermaterial: Metallgehäuse
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: Kabelmontage
Produktpalette: KV
SVHC: Lead (21-Jan-2025)

Hersteller: NXP Semiconductors
16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 128KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 64

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified

Hersteller: NXP Semiconductors
16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 128KB Flash, 50MHz, -40/+150degC, Automotive Qualified, QFP 64

Hersteller: Altech
Circuit Breaker Accessories Q12-L,Junction Box, 85x85x37mm

Hersteller: JST Sales America Inc.
Description: CONN HEADER SMD R/A 1POS 1.2MM
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): 2A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 1
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Male Blade
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Natural
Contact Finish - Mating: Gold
Contact Shape: Rectangular
Insulation Height: 0.055" (1.40mm)
Shrouding: Shrouded - 3 Wall
Insulation Material: Thermoplastic

Hersteller: Chemi-Con
Description: CAP ALUM 82UF 20% 35V RADIAL TH
Packaging: Tape & Box (TB)
Tolerance: ±20%
Package / Case: Radial, Can
Size / Dimension: 0.248" Dia (6.30mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 105°C
Applications: Automotive
Lead Spacing: 0.098" (2.50mm)
Ratings: AEC-Q200
Lifetime @ Temp.: 2000 Hrs @ 105°C
Height - Seated (Max): 0.650" (16.50mm)
Part Status: Active
Capacitance: 82 µF
Voltage - Rated: 35 V
Impedance: 250 MOhms
Ripple Current @ Low Frequency: 156 mA @ 120 Hz

Hersteller: ams-OSRAM USA INC.
Description: LED OSCONIQ P 2226 GRN 525NM SMD
Packaging: Tape & Reel (TR)
Package / Case: 1009 (2622 Metric)
Color: Green
Wavelength: 525nm (Typ)
Size / Dimension: 0.102" L x 0.087" W (2.60mm x 2.20mm)
Mounting Type: Surface Mount
Voltage - Forward (Vf) (Typ): 3.35V
Current - Test: 100mA
Viewing Angle: 110°
Current - Max: 250mA
Supplier Device Package: SMD
Lumens/Watt @ Current - Test: 93 lm/W
Height - Seated (Max): 0.052" (1.31mm)
Temperature - Test: 25°C
Luminous Flux @ Current/Temperature: 31lm (Typ)

Hersteller: TDK Corporation
Description: FERRITE BEAD 300 OHM 1206 1LN
Packaging: Tape & Reel (TR)
Package / Case: 1206 (3216 Metric), Array, 8 PC Pad
Filter Type: Signal Line
Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Height (Max): 0.039" (1.00mm)
Current Rating (Max): 200mA
DC Resistance (DCR) (Max): 400mOhm
Number of Lines: 4
Impedance @ Frequency: 300 Ohms @ 100 MHz

Hersteller: Pulse Electronics
Description: FIXED IND 680NH 3.4A 42MOHM SMD
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard
Size / Dimension: 0.126" L x 0.126" W (3.20mm x 3.20mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 125°C
DC Resistance (DCR): 42mOhm Max
Frequency - Self Resonant: 63MHz
Current - Saturation (Isat): 5.8A
Material - Core: Iron
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Part Status: Active
Inductance: 680 nH
Current Rating (Amps): 3.4 A

Hersteller: Pulse Electronics
Description: FIXED IND 680NH 3.4A 42MOHM SMD
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.126" L x 0.126" W (3.20mm x 3.20mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 125°C
DC Resistance (DCR): 42mOhm Max
Frequency - Self Resonant: 63MHz
Current - Saturation (Isat): 5.8A
Material - Core: Iron
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Part Status: Active
Inductance: 680 nH
Current Rating (Amps): 3.4 A

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified

Hersteller: NXP Semiconductors
16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 128KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 64

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified

Hersteller: NXP Semiconductors
16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 128KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 64

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified

Hersteller: NXP Semiconductors
16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 128KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 64

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified

Hersteller: NXP Semiconductors
16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 128KB Flash, 50MHz, -40/+150degC, Automotive Qualified, QFP 64

Hersteller: Curtis Industries
Description: CHANNEL FOR PC BOARD OR SCKT
Packaging: Bulk
For Use With/Related Products: CUS, RS Series Sockets
Accessory Type: Channel, Track