Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100

Hersteller: FESTO
Category: Actuators
Description: Compact cylinder; Piston diam: 32mm; Piston stroke: 60mm
Type of pneumatic module: compact cylinder
Piston diameter: 32mm
Piston stroke: 60mm
Thread: G 1/8"; M10x1,25
Operating pressure: 0.6...10bar
Body material: aluminium
Seal material: NBR caoutchouc
Operating temperature: -20...80°C
Pneumatic components features: mechanical amortization; medium: compressed air, filtered, lubricated or not

Hersteller: TE Connectivity AMP Connectors
Description: CONN HEADER VERT 200POS 1.27MM
Packaging: Tube
Features: Ground Bus (Plane), Mounting Flange
Connector Type: Plug
Voltage Rating: 30VAC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 200
Number of Rows: 2
Style: Board to Board
Operating Temperature: -65°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit, Solder
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.340" (8.64mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Thermoplastic
Row Spacing - Mating: 0.100" (2.54mm)

Hersteller: TDK Corporation
Description: FIXED IND 10UH 380MA 500MOHM SMD
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: 0805 (2012 Metric)
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 500mOhm
Current - Saturation (Isat): 155mA
Supplier Device Package: 0805 (2012 Metric)
Height - Seated (Max): 0.053" (1.35mm)
Part Status: Obsolete
Inductance: 10 µH
Current Rating (Amps): 380 mA

Hersteller: ams-OSRAM USA INC.
Description: LED OSCONIQ COOL WHT 5000K SMD
Packaging: Tape & Reel (TR)
Package / Case: 1212 (3030 Metric)
Color: White, Cool
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Voltage - Forward (Vf) (Typ): 6.4V
Current - Test: 150mA
Viewing Angle: 120°
Current - Max: 200mA
Supplier Device Package: SMD
Lumens/Watt @ Current - Test: 159 lm/W
Height - Seated (Max): 0.030" (0.75mm)
CCT (K): 5000K
CRI (Color Rendering Index): 70
Flux @ 25°C, Current - Test: 153lm (145lm ~ 160lm)
Part Status: Obsolete

Hersteller: NXP Semiconductors
RF System on a Chip - SoC Kinetis W 32-bit MCU, Arm Cortex-M0+, 512KB Flash, 64KB SRAM, 48MHz, BLE, 40QFN

Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100

Hersteller: NXP Semiconductors
RF System on a Chip - SoC Kinetis W 32-bit MCU, Arm Cortex-M0+, 512KB Flash, 64KB SRAM, 48MHz, BLE, 40QFN