Produkte > PRECI-DIP > 550-10-272M20-001152
550-10-272M20-001152

550-10-272M20-001152 Preci-Dip


catalog.pdf Hersteller: Preci-Dip
BGA INTERCONNECT SOCKETS 1.27 MM GRID, THROUGH HOLE SOLDER TAILS AND CONNECTING PIN 0.40 MM
Produkt ist nicht verfügbar

Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 550-10-272M20-001152 Preci-Dip

Description: BGA SOLDER TAIL, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: BGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 272 (20 x 20), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Brass, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.

Weitere Produktangebote 550-10-272M20-001152

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
550-10-272M20-001152 Hersteller : Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 272 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH