550-10-272M20-001152 Preci-Dip
Hersteller: Preci-Dip
BGA INTERCONNECT SOCKETS 1.27 MM GRID, THROUGH HOLE SOLDER TAILS AND CONNECTING PIN 0.40 MM
BGA INTERCONNECT SOCKETS 1.27 MM GRID, THROUGH HOLE SOLDER TAILS AND CONNECTING PIN 0.40 MM
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details 550-10-272M20-001152 Preci-Dip
Description: BGA SOLDER TAIL, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: BGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 272 (20 x 20), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Brass, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Weitere Produktangebote 550-10-272M20-001152
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
550-10-272M20-001152 | Hersteller : Preci-Dip |
Description: BGA SOLDER TAIL Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 272 (20 x 20) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |