609-50ABS3

609-50ABS3

609-50ABS3

Hersteller: Wakefield-Vette
Heat Sinks Pin Fin Heat Sink/Clip Assembly for 40/45mm BGA and PowerPC Packages, Aluminum, Black Anodized, 73.5x50.8x12.7mm, Bergquist Q-Pad 3, 0.14 C in2/w
intergrated-heatsink-wakefield-273031.pdf
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auf Bestellung 420 Stücke
Lieferzeit 14-28 Tag (e)

Technische Details 609-50ABS3

Description: HEATSINK FOR POWERPC CPU BLK, Base Part Number: 609-50, Material Finish: Black Anodized, Material: Aluminum, Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 250 LFM, Fin Height: 0.500" (12.70mm), Width: 2.000" (50.80mm), Length: 2.895" (73.53mm), Shape: Rectangular, Pin Fins, Attachment Method: Clip, Thermal Material, Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Type: Top Mount, Part Status: Active, Packaging: Bulk, Manufacturer: Wakefield-Vette.

Preis 609-50ABS3 ab 0 EUR bis 0 EUR

609-50ABS3
609-50ABS3
Hersteller: Wakefield-Vette
Description: HEATSINK FOR POWERPC CPU BLK
Base Part Number: 609-50
Material Finish: Black Anodized
Material: Aluminum
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 250 LFM
Fin Height: 0.500" (12.70mm)
Width: 2.000" (50.80mm)
Length: 2.895" (73.53mm)
Shape: Rectangular, Pin Fins
Attachment Method: Clip, Thermal Material
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Type: Top Mount
Part Status: Active
Packaging: Bulk
Manufacturer: Wakefield-Vette
609.pdf
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