Suchergebnisse für "632310" : > 60
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Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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63231000 | BOPLA |
Category: Multipurpose Enclosures Description: Enclosure: multipurpose; X: 80mm; Y: 160mm; Z: 87mm; EUROMAS II; ABS Enclosure material: ABS Body colour: grey IP rating: IP65 Type of enclosure: multipurpose Dimension Y: 160mm Dimension X: 80mm Dimension Z: 87mm Cover colour: grey Enclosure series: EUROMAS II Kit contents: 2 copper plated screws with washers; screw x4 Related items: EM-WL |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
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63231000 | BOPLA |
Category: Multipurpose Enclosures Description: Enclosure: multipurpose; X: 80mm; Y: 160mm; Z: 87mm; EUROMAS II; ABS Enclosure material: ABS Body colour: grey IP rating: IP65 Type of enclosure: multipurpose Dimension Y: 160mm Dimension X: 80mm Dimension Z: 87mm Cover colour: grey Enclosure series: EUROMAS II Kit contents: 2 copper plated screws with washers; screw x4 Related items: EM-WL Anzahl je Verpackung: 1 Stücke |
auf Bestellung 2 Stücke: Lieferzeit 7-14 Tag (e) |
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614-93-632-31-012000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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HOA6323-101 | HONEYWELL |
Category: Sensors and Transducers - Unclassified Description: Sensor: photoelectric |
auf Bestellung 77 Stücke: Lieferzeit 14-21 Tag (e) |
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CG46323-102 | PANASONIC | 1998 |
auf Bestellung 57 Stücke: Lieferzeit 21-28 Tag (e) |
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CG46323-102 | PANASONIC |
auf Bestellung 57 Stücke: Lieferzeit 21-28 Tag (e) |
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323100000 | C&K |
Description: SWITCH THUMB BCD 0.1A 120V Packaging: Bulk Mounting Type: Panel Mount, Snap-In Operating Temperature: -40°C ~ 65°C Termination Style: Card Edge/Solder Pad Output Code: BCD Read Out: 0 ~ 9 Contact Rating @ Voltage: 0.1A @ 120VAC/28VDC Actuator Type: Thumbwheel Panel Cutout Dimensions: Rectangular - 31.00mm x 24.28mm Contact Material: Copper Alloy End Caps: Included Section Width: 0.315" (8.00mm) Number of Sections: 2 |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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3565-2 | Pomona Electronics |
Description: ADAPT PIN 0.093" TO BAN JCK RED Packaging: Bulk Color: Red Convert From (Adapter End): Pin, 0.093" Dia Convert To (Adapter End): Banana Jack Part Status: Active |
auf Bestellung 314 Stücke: Lieferzeit 10-14 Tag (e) |
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MM74HC125M... | ONSEMI |
Description: ONSEMI - MM74HC125M... - Puffer / Leitungstreiber, 74HC125, 2V bis 6V, SOIC-14 tariffCode: 85423990 Logik-IC-Sockelnummer: 74125 rohsCompliant: YES Logik-IC-Familie: 74HC Bauform - Logikbaustein: SOIC hazardous: false rohsPhthalatesCompliant: YES MSL: - usEccn: EAR99 Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 2V Logikfamilie / Sockelnummer: 74HC125 euEccn: NLR Logikbaustein: Puffer, nicht invertierend Qualifizierungsstandard der Automobilindustrie: - Anzahl der Pins: 14Pin(s) Produktpalette: Multicomp Pro RJ45 Adapter productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 6V Betriebstemperatur, max.: 85°C SVHC: No SVHC (23-Jan-2024) |
auf Bestellung 2231 Stücke: Lieferzeit 14-21 Tag (e) |
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SN74LVC1G86DCKT | Texas Instruments |
Description: IC GATE XOR 1CH 2-INP SC70-5 Packaging: Tape & Reel (TR) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 2 Supplier Device Package: SC-70-5 Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 10 µA |
auf Bestellung 7500 Stücke: Lieferzeit 10-14 Tag (e) |
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SN74LVC1G86DCKT | Texas Instruments |
Description: IC GATE XOR 1CH 2-INP SC70-5 Packaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 2 Supplier Device Package: SC-70-5 Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 10 µA |
auf Bestellung 7917 Stücke: Lieferzeit 10-14 Tag (e) |
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SN74LVC1G86DCKT | Texas Instruments |
Description: IC GATE XOR 1CH 2-INP SC70-5 Packaging: Bulk Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 2 Supplier Device Package: SC-70-5 Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 10 µA |
auf Bestellung 113873 Stücke: Lieferzeit 10-14 Tag (e) |
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614-41-632-31-002000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
Produkt ist nicht verfügbar |
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614-41-632-31-002000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-41-632-31-007000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
Produkt ist nicht verfügbar |
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614-41-632-31-007000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-41-632-31-012000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
Produkt ist nicht verfügbar |
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614-41-632-31-012000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-41-632-31-018000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
Produkt ist nicht verfügbar |
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614-41-632-31-018000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-43-632-31-002000 | Mill-Max | IC & Component Sockets 32P DIP CARRIER SKT .136L ULT LO PROFILE |
Produkt ist nicht verfügbar |
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614-43-632-31-002000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-43-632-31-007000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-43-632-31-007000 | Mill-Max | IC & Component Sockets 32P DIP CARRIER SKT .146L LOW PROFILE |
Produkt ist nicht verfügbar |
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614-43-632-31-012000 | Mill-Max | IC & Component Sockets 32 PIN CARRIER |
Produkt ist nicht verfügbar |
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614-43-632-31-012000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-43-632-31-018000 | Mill-Max | IC & Component Sockets 32P DIP CARRIER SKT .170L ULT LO PROFILE |
Produkt ist nicht verfügbar |
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614-43-632-31-018000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-83-632-31-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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614-83-632-31-012101 | Preci-dip | Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |
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614-87-632-31-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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614-87-632-31-012101 | Preci-Dip | Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |
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614-87-632-31-012101 | Preci-dip | Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |
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614-91-632-31-002000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
Produkt ist nicht verfügbar |
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614-91-632-31-002000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-91-632-31-007000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-91-632-31-007000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
Produkt ist nicht verfügbar |
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614-91-632-31-012000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
Produkt ist nicht verfügbar |
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614-91-632-31-012000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-91-632-31-018000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
Produkt ist nicht verfügbar |
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614-91-632-31-018000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-93-632-31-002000 | Mill-Max | IC & Component Sockets 32P DIP CARRIER SKT .136L ULT LO PROFILE |
Produkt ist nicht verfügbar |
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614-93-632-31-002000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-93-632-31-007000 | Mill-Max Manufacturing Corp. |
Description: SOCKET CARRIER LOWPRO .600 32POS Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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614-93-632-31-007000 | Mill-Max | IC & Component Sockets 32P DIP CARRIER SKT .146L LOW PROFILE |
Produkt ist nicht verfügbar |
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614-93-632-31-012000 | Mill-Max | IC & Component Sockets 32 PIN CARRIER |
Produkt ist nicht verfügbar |
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614-93-632-31-018000 | Mill-Max | IC & Component Sockets 32P DIP CARRIER SKT .170L ULT LO PROFILE |
Produkt ist nicht verfügbar |
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614-93-632-31-018000 | Mill-Max Manufacturing Corp. |
Description: SOCKET CARRIER LOWPRO .600 32POS Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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ECIV6323-105S0A1A0A0 | ITT Cannon | EV Connectors |
Produkt ist nicht verfügbar |
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HOA6323-101 | HONEYWELL |
Category: Sensors and Transducers - Unclassified Description: Sensor: photoelectric Anzahl je Verpackung: 1 Stücke |
auf Bestellung 77 Stücke: Lieferzeit 7-14 Tag (e) |
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HOA6323-101 | Honeywell | INFRARED SENSORS |
Produkt ist nicht verfügbar |
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IEGF6-32310-3-V | Sensata-Airpax |
Description: CIR BRKR MAG-HYDR LEVER Packaging: Bulk Mounting Type: Panel Mount Actuator Type: Lever Approval Agency: CSA, TUV, UL1077 Breaker Type: Magnetic (Hydraulic Delay) Number of Poles: 1 |
Produkt ist nicht verfügbar |
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IEGF6-32310-3-V | AIRPAX | Circuit Breakers Cir Brkr Hyd Mag |
Produkt ist nicht verfügbar |
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6323 SL005 | Alpha Wire | Multi-Conductor Cables 24AWG 10PR FOILBRD 100 FT SPOOL SLATE |
Produkt ist nicht verfügbar |
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929667-01-05-EU | 3M |
Description: CONN HEADER R/A 10POS 2.54MM Packaging: Bulk Connector Type: Header Current Rating (Amps): 2.5A Mounting Type: Through Hole, Right Angle Number of Positions: 10 Number of Rows: 2 Style: Board to Board Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Contact Shape: Square Contact Length - Post: 0.110" (2.79mm) Insulation Height: 0.215" (5.45mm) Shrouding: Unshrouded Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.235" (5.97mm) |
Produkt ist nicht verfügbar |
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MS27653T9F6P | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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MS27653T9F6PA | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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MS27653T9F6PB | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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MS27653T9F6PC | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
63231000 |
Hersteller: BOPLA
Category: Multipurpose Enclosures
Description: Enclosure: multipurpose; X: 80mm; Y: 160mm; Z: 87mm; EUROMAS II; ABS
Enclosure material: ABS
Body colour: grey
IP rating: IP65
Type of enclosure: multipurpose
Dimension Y: 160mm
Dimension X: 80mm
Dimension Z: 87mm
Cover colour: grey
Enclosure series: EUROMAS II
Kit contents: 2 copper plated screws with washers; screw x4
Related items: EM-WL
Category: Multipurpose Enclosures
Description: Enclosure: multipurpose; X: 80mm; Y: 160mm; Z: 87mm; EUROMAS II; ABS
Enclosure material: ABS
Body colour: grey
IP rating: IP65
Type of enclosure: multipurpose
Dimension Y: 160mm
Dimension X: 80mm
Dimension Z: 87mm
Cover colour: grey
Enclosure series: EUROMAS II
Kit contents: 2 copper plated screws with washers; screw x4
Related items: EM-WL
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 35.75 EUR |
63231000 |
Hersteller: BOPLA
Category: Multipurpose Enclosures
Description: Enclosure: multipurpose; X: 80mm; Y: 160mm; Z: 87mm; EUROMAS II; ABS
Enclosure material: ABS
Body colour: grey
IP rating: IP65
Type of enclosure: multipurpose
Dimension Y: 160mm
Dimension X: 80mm
Dimension Z: 87mm
Cover colour: grey
Enclosure series: EUROMAS II
Kit contents: 2 copper plated screws with washers; screw x4
Related items: EM-WL
Anzahl je Verpackung: 1 Stücke
Category: Multipurpose Enclosures
Description: Enclosure: multipurpose; X: 80mm; Y: 160mm; Z: 87mm; EUROMAS II; ABS
Enclosure material: ABS
Body colour: grey
IP rating: IP65
Type of enclosure: multipurpose
Dimension Y: 160mm
Dimension X: 80mm
Dimension Z: 87mm
Cover colour: grey
Enclosure series: EUROMAS II
Kit contents: 2 copper plated screws with washers; screw x4
Related items: EM-WL
Anzahl je Verpackung: 1 Stücke
auf Bestellung 2 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 35.75 EUR |
3+ | 23.84 EUR |
10+ | 19.71 EUR |
614-93-632-31-012000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.13 EUR |
12+ | 11.87 EUR |
36+ | 11.22 EUR |
HOA6323-101 |
Hersteller: HONEYWELL
Category: Sensors and Transducers - Unclassified
Description: Sensor: photoelectric
Category: Sensors and Transducers - Unclassified
Description: Sensor: photoelectric
auf Bestellung 77 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 56.56 EUR |
15+ | 53.2 EUR |
323100000 |
Hersteller: C&K
Description: SWITCH THUMB BCD 0.1A 120V
Packaging: Bulk
Mounting Type: Panel Mount, Snap-In
Operating Temperature: -40°C ~ 65°C
Termination Style: Card Edge/Solder Pad
Output Code: BCD
Read Out: 0 ~ 9
Contact Rating @ Voltage: 0.1A @ 120VAC/28VDC
Actuator Type: Thumbwheel
Panel Cutout Dimensions: Rectangular - 31.00mm x 24.28mm
Contact Material: Copper Alloy
End Caps: Included
Section Width: 0.315" (8.00mm)
Number of Sections: 2
Description: SWITCH THUMB BCD 0.1A 120V
Packaging: Bulk
Mounting Type: Panel Mount, Snap-In
Operating Temperature: -40°C ~ 65°C
Termination Style: Card Edge/Solder Pad
Output Code: BCD
Read Out: 0 ~ 9
Contact Rating @ Voltage: 0.1A @ 120VAC/28VDC
Actuator Type: Thumbwheel
Panel Cutout Dimensions: Rectangular - 31.00mm x 24.28mm
Contact Material: Copper Alloy
End Caps: Included
Section Width: 0.315" (8.00mm)
Number of Sections: 2
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 164.19 EUR |
10+ | 152.75 EUR |
25+ | 145.11 EUR |
3565-2 |
Hersteller: Pomona Electronics
Description: ADAPT PIN 0.093" TO BAN JCK RED
Packaging: Bulk
Color: Red
Convert From (Adapter End): Pin, 0.093" Dia
Convert To (Adapter End): Banana Jack
Part Status: Active
Description: ADAPT PIN 0.093" TO BAN JCK RED
Packaging: Bulk
Color: Red
Convert From (Adapter End): Pin, 0.093" Dia
Convert To (Adapter End): Banana Jack
Part Status: Active
auf Bestellung 314 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.37 EUR |
25+ | 10.36 EUR |
MM74HC125M... |
Hersteller: ONSEMI
Description: ONSEMI - MM74HC125M... - Puffer / Leitungstreiber, 74HC125, 2V bis 6V, SOIC-14
tariffCode: 85423990
Logik-IC-Sockelnummer: 74125
rohsCompliant: YES
Logik-IC-Familie: 74HC
Bauform - Logikbaustein: SOIC
hazardous: false
rohsPhthalatesCompliant: YES
MSL: -
usEccn: EAR99
Betriebstemperatur, min.: -40°C
Versorgungsspannung, min.: 2V
Logikfamilie / Sockelnummer: 74HC125
euEccn: NLR
Logikbaustein: Puffer, nicht invertierend
Qualifizierungsstandard der Automobilindustrie: -
Anzahl der Pins: 14Pin(s)
Produktpalette: Multicomp Pro RJ45 Adapter
productTraceability: Yes-Date/Lot Code
Versorgungsspannung, max.: 6V
Betriebstemperatur, max.: 85°C
SVHC: No SVHC (23-Jan-2024)
Description: ONSEMI - MM74HC125M... - Puffer / Leitungstreiber, 74HC125, 2V bis 6V, SOIC-14
tariffCode: 85423990
Logik-IC-Sockelnummer: 74125
rohsCompliant: YES
Logik-IC-Familie: 74HC
Bauform - Logikbaustein: SOIC
hazardous: false
rohsPhthalatesCompliant: YES
MSL: -
usEccn: EAR99
Betriebstemperatur, min.: -40°C
Versorgungsspannung, min.: 2V
Logikfamilie / Sockelnummer: 74HC125
euEccn: NLR
Logikbaustein: Puffer, nicht invertierend
Qualifizierungsstandard der Automobilindustrie: -
Anzahl der Pins: 14Pin(s)
Produktpalette: Multicomp Pro RJ45 Adapter
productTraceability: Yes-Date/Lot Code
Versorgungsspannung, max.: 6V
Betriebstemperatur, max.: 85°C
SVHC: No SVHC (23-Jan-2024)
auf Bestellung 2231 Stücke:
Lieferzeit 14-21 Tag (e)SN74LVC1G86DCKT |
Hersteller: Texas Instruments
Description: IC GATE XOR 1CH 2-INP SC70-5
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: SC-70-5
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 10 µA
Description: IC GATE XOR 1CH 2-INP SC70-5
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: SC-70-5
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 10 µA
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
250+ | 0.98 EUR |
500+ | 0.86 EUR |
1250+ | 0.68 EUR |
2500+ | 0.64 EUR |
6250+ | 0.6 EUR |
SN74LVC1G86DCKT |
Hersteller: Texas Instruments
Description: IC GATE XOR 1CH 2-INP SC70-5
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: SC-70-5
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 10 µA
Description: IC GATE XOR 1CH 2-INP SC70-5
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: SC-70-5
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 10 µA
auf Bestellung 7917 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
12+ | 1.5 EUR |
14+ | 1.34 EUR |
25+ | 1.27 EUR |
100+ | 1.05 EUR |
SN74LVC1G86DCKT |
Hersteller: Texas Instruments
Description: IC GATE XOR 1CH 2-INP SC70-5
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: SC-70-5
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 10 µA
Description: IC GATE XOR 1CH 2-INP SC70-5
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: SC-70-5
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 10 µA
auf Bestellung 113873 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
761+ | 0.64 EUR |
614-41-632-31-002000 |
Hersteller: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
Produkt ist nicht verfügbar
614-41-632-31-002000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-41-632-31-007000 |
Hersteller: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
Produkt ist nicht verfügbar
614-41-632-31-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-41-632-31-012000 |
Hersteller: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
Produkt ist nicht verfügbar
614-41-632-31-012000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-41-632-31-018000 |
Hersteller: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
Produkt ist nicht verfügbar
614-41-632-31-018000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-43-632-31-002000 |
Hersteller: Mill-Max
IC & Component Sockets 32P DIP CARRIER SKT .136L ULT LO PROFILE
IC & Component Sockets 32P DIP CARRIER SKT .136L ULT LO PROFILE
Produkt ist nicht verfügbar
614-43-632-31-002000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-43-632-31-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-43-632-31-007000 |
Hersteller: Mill-Max
IC & Component Sockets 32P DIP CARRIER SKT .146L LOW PROFILE
IC & Component Sockets 32P DIP CARRIER SKT .146L LOW PROFILE
Produkt ist nicht verfügbar
614-43-632-31-012000 |
Hersteller: Mill-Max
IC & Component Sockets 32 PIN CARRIER
IC & Component Sockets 32 PIN CARRIER
Produkt ist nicht verfügbar
614-43-632-31-012000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-43-632-31-018000 |
Hersteller: Mill-Max
IC & Component Sockets 32P DIP CARRIER SKT .170L ULT LO PROFILE
IC & Component Sockets 32P DIP CARRIER SKT .170L ULT LO PROFILE
Produkt ist nicht verfügbar
614-43-632-31-018000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-83-632-31-012101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-632-31-012101 |
Hersteller: Preci-dip
Board to Board & Mezzanine Connectors
Board to Board & Mezzanine Connectors
Produkt ist nicht verfügbar
614-87-632-31-012101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-632-31-012101 |
Hersteller: Preci-Dip
Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole
Produkt ist nicht verfügbar
614-87-632-31-012101 |
Hersteller: Preci-dip
Board to Board & Mezzanine Connectors
Board to Board & Mezzanine Connectors
Produkt ist nicht verfügbar
614-91-632-31-002000 |
Hersteller: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
Produkt ist nicht verfügbar
614-91-632-31-002000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-91-632-31-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-91-632-31-007000 |
Hersteller: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
Produkt ist nicht verfügbar
614-91-632-31-012000 |
Hersteller: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
Produkt ist nicht verfügbar
614-91-632-31-012000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-91-632-31-018000 |
Hersteller: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
Produkt ist nicht verfügbar
614-91-632-31-018000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-93-632-31-002000 |
Hersteller: Mill-Max
IC & Component Sockets 32P DIP CARRIER SKT .136L ULT LO PROFILE
IC & Component Sockets 32P DIP CARRIER SKT .136L ULT LO PROFILE
Produkt ist nicht verfügbar
614-93-632-31-002000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-93-632-31-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET CARRIER LOWPRO .600 32POS
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SOCKET CARRIER LOWPRO .600 32POS
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
614-93-632-31-007000 |
Hersteller: Mill-Max
IC & Component Sockets 32P DIP CARRIER SKT .146L LOW PROFILE
IC & Component Sockets 32P DIP CARRIER SKT .146L LOW PROFILE
Produkt ist nicht verfügbar
614-93-632-31-012000 |
Hersteller: Mill-Max
IC & Component Sockets 32 PIN CARRIER
IC & Component Sockets 32 PIN CARRIER
Produkt ist nicht verfügbar
614-93-632-31-018000 |
Hersteller: Mill-Max
IC & Component Sockets 32P DIP CARRIER SKT .170L ULT LO PROFILE
IC & Component Sockets 32P DIP CARRIER SKT .170L ULT LO PROFILE
Produkt ist nicht verfügbar
614-93-632-31-018000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET CARRIER LOWPRO .600 32POS
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SOCKET CARRIER LOWPRO .600 32POS
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
HOA6323-101 |
Hersteller: HONEYWELL
Category: Sensors and Transducers - Unclassified
Description: Sensor: photoelectric
Anzahl je Verpackung: 1 Stücke
Category: Sensors and Transducers - Unclassified
Description: Sensor: photoelectric
Anzahl je Verpackung: 1 Stücke
auf Bestellung 77 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 56.56 EUR |
15+ | 53.2 EUR |
IEGF6-32310-3-V |
Hersteller: Sensata-Airpax
Description: CIR BRKR MAG-HYDR LEVER
Packaging: Bulk
Mounting Type: Panel Mount
Actuator Type: Lever
Approval Agency: CSA, TUV, UL1077
Breaker Type: Magnetic (Hydraulic Delay)
Number of Poles: 1
Description: CIR BRKR MAG-HYDR LEVER
Packaging: Bulk
Mounting Type: Panel Mount
Actuator Type: Lever
Approval Agency: CSA, TUV, UL1077
Breaker Type: Magnetic (Hydraulic Delay)
Number of Poles: 1
Produkt ist nicht verfügbar
6323 SL005 |
Hersteller: Alpha Wire
Multi-Conductor Cables 24AWG 10PR FOILBRD 100 FT SPOOL SLATE
Multi-Conductor Cables 24AWG 10PR FOILBRD 100 FT SPOOL SLATE
Produkt ist nicht verfügbar
929667-01-05-EU |
Hersteller: 3M
Description: CONN HEADER R/A 10POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 10
Number of Rows: 2
Style: Board to Board
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.215" (5.45mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.235" (5.97mm)
Description: CONN HEADER R/A 10POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 10
Number of Rows: 2
Style: Board to Board
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.215" (5.45mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.235" (5.97mm)
Produkt ist nicht verfügbar
MS27653T9F6P |
Produkt ist nicht verfügbar
MS27653T9F6PA |
Produkt ist nicht verfügbar
MS27653T9F6PB |
Produkt ist nicht verfügbar
MS27653T9F6PC |
Produkt ist nicht verfügbar
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