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7-1437539-7 TE Connectivity

DDEController?Action=showdoc&DocId=Customer+Drawing%7F1437539-2%7FA3%7Fpdf%7FEnglish%7FENG_CD_1437539-2_A3.pdf%7F1437539-2 Hersteller: TE Connectivity
714375397-TEC Semiconductors - accessories - Unclass.
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Technische Details 7-1437539-7 TE Connectivity

Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm).

Weitere Produktangebote 7-1437539-7

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7-1437539-7 Hersteller : TE Connectivity AMP Connectors DDEController?Action=showdoc&DocId=Customer+Drawing%7F1437539-2%7FA3%7Fpdf%7FEnglish%7FENG_CD_1437539-2_A3.pdf%7F1437539-2 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 5.00µin (0.127µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH