70-3213-0810 Kester Solder
Hersteller: Kester SolderDescription: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 309 EUR |
| 5+ | 266.16 EUR |
| 10+ | 249.54 EUR |
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Technische Details 70-3213-0810 Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 500GM, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 423 ~ 424°F (217 ~ 218°C), Form: Jar, 17.64 oz (500g), Mesh Type: 3, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C), Shelf Life Start: Date of Manufacture, Shelf Life: 8 Months.