Suchergebnisse für "787518" : 13
Art der Ansicht :
Mindestbestellmenge: 8
Mindestbestellmenge: 137
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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NOSC686M006S0200 | KYOCERA AVX |
Description: CAP NIOB OXID 68UF 20% 6.3V 2312 Tolerance: ±20% Features: Low ESR Packaging: Cut Tape (CT) Package / Case: 2312 (6032 Metric) Size / Dimension: 0.236" L x 0.126" W (6.00mm x 3.20mm) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Manufacturer Size Code: C Dissipation Factor: 6% Supplier Device Package: 2312 (6032 Metric) Height - Seated (Max): 0.122" (3.10mm) Capacitance: 68 µF Voltage - Rated: 6.3 V ESR (Equivalent Series Resistance): 200 mOhms Current - Leakage: 8.2 µA |
auf Bestellung 5928 Stücke: Lieferzeit 21-28 Tag (e) |
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P89LPC921FDH,518 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20TSSOP Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Obsolete Number of I/O: 18 DigiKey Programmable: Not Verified |
auf Bestellung 210 Stücke: Lieferzeit 21-28 Tag (e) |
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4-5178751-8 | TE Connectivity | Board to Board & Mezzanine Connectors AMPMODU 2MM HDR V-TYPE ASSY |
Produkt ist nicht verfügbar |
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BFC237875183 | Vishay Beyschlag/Draloric/BC Components |
Description: CAP FILM 0.018UF 5% 1KVDC RADIAL Packaging: Tape & Reel (TR) Tolerance: ±5% Features: Long Life Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -55°C ~ 85°C Applications: High Pulse, DV/DT Lead Spacing: 0.886" (22.50mm) Termination: PC Pins Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 300V Voltage Rating - DC: 1000V (1kV) Height - Seated (Max): 0.728" (18.50mm) Capacitance: 0.018 µF Size / Dimension: 1.024" L x 0.236" W (26.00mm x 6.00mm) |
Produkt ist nicht verfügbar |
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BFC237875183 | Vishay / BC Components | Film Capacitors .018uF 5% 1000volts |
Produkt ist nicht verfügbar |
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87518 | Brady Corporation |
Description: TAG BRASS RND 1.5 VAC 451-475 Packaging: Bulk Color: Black Legend, Brass Background Material: Brass Label Type: VAC (Vacuum) Label Size: 38.10mm Dia Part Status: Active |
Produkt ist nicht verfügbar |
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MCIMX6U6AVM08ACR | NXP Semiconductors | SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin MAP-BGA T/R |
Produkt ist nicht verfügbar |
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MCIMX6U6AVM08ACR | NXP USA Inc. |
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA Packaging: Tape & Reel (TR) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6U6AVM08ACR | NXP Semiconductors | Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 800MHz, MAPBGA 624 |
Produkt ist nicht verfügbar |
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NOSC686M006S0200 | KYOCERA AVX |
Description: CAP NIOB OXID 68UF 20% 6.3V 2312 Tolerance: ±20% Features: Low ESR Packaging: Tape & Reel (TR) Package / Case: 2312 (6032 Metric) Size / Dimension: 0.236" L x 0.126" W (6.00mm x 3.20mm) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Manufacturer Size Code: C Dissipation Factor: 6% Supplier Device Package: 2312 (6032 Metric) Height - Seated (Max): 0.122" (3.10mm) Capacitance: 68 µF Voltage - Rated: 6.3 V ESR (Equivalent Series Resistance): 200 mOhms Current - Leakage: 8.2 µA |
Produkt ist nicht verfügbar |
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P89LPC921FDH,518 | NXP Semiconductors | MCU 8-bit 80C51 CISC 4KB Flash 2.5V/3.3V 20-Pin TSSOP T/R |
Produkt ist nicht verfügbar |
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P89LPC921FDH,518 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Obsolete Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
NOSC686M006S0200 |
Hersteller: KYOCERA AVX
Description: CAP NIOB OXID 68UF 20% 6.3V 2312
Tolerance: ±20%
Features: Low ESR
Packaging: Cut Tape (CT)
Package / Case: 2312 (6032 Metric)
Size / Dimension: 0.236" L x 0.126" W (6.00mm x 3.20mm)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Manufacturer Size Code: C
Dissipation Factor: 6%
Supplier Device Package: 2312 (6032 Metric)
Height - Seated (Max): 0.122" (3.10mm)
Capacitance: 68 µF
Voltage - Rated: 6.3 V
ESR (Equivalent Series Resistance): 200 mOhms
Current - Leakage: 8.2 µA
Description: CAP NIOB OXID 68UF 20% 6.3V 2312
Tolerance: ±20%
Features: Low ESR
Packaging: Cut Tape (CT)
Package / Case: 2312 (6032 Metric)
Size / Dimension: 0.236" L x 0.126" W (6.00mm x 3.20mm)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Manufacturer Size Code: C
Dissipation Factor: 6%
Supplier Device Package: 2312 (6032 Metric)
Height - Seated (Max): 0.122" (3.10mm)
Capacitance: 68 µF
Voltage - Rated: 6.3 V
ESR (Equivalent Series Resistance): 200 mOhms
Current - Leakage: 8.2 µA
auf Bestellung 5928 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 3.61 EUR |
10+ | 2.72 EUR |
50+ | 2.48 EUR |
100+ | 2.03 EUR |
500+ | 1.62 EUR |
1000+ | 1.43 EUR |
P89LPC921FDH,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 210 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
137+ | 5.26 EUR |
4-5178751-8 |
Hersteller: TE Connectivity
Board to Board & Mezzanine Connectors AMPMODU 2MM HDR V-TYPE ASSY
Board to Board & Mezzanine Connectors AMPMODU 2MM HDR V-TYPE ASSY
Produkt ist nicht verfügbar
BFC237875183 |
Hersteller: Vishay Beyschlag/Draloric/BC Components
Description: CAP FILM 0.018UF 5% 1KVDC RADIAL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Features: Long Life
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 85°C
Applications: High Pulse, DV/DT
Lead Spacing: 0.886" (22.50mm)
Termination: PC Pins
Dielectric Material: Polypropylene (PP), Metallized
Voltage Rating - AC: 300V
Voltage Rating - DC: 1000V (1kV)
Height - Seated (Max): 0.728" (18.50mm)
Capacitance: 0.018 µF
Size / Dimension: 1.024" L x 0.236" W (26.00mm x 6.00mm)
Description: CAP FILM 0.018UF 5% 1KVDC RADIAL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Features: Long Life
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 85°C
Applications: High Pulse, DV/DT
Lead Spacing: 0.886" (22.50mm)
Termination: PC Pins
Dielectric Material: Polypropylene (PP), Metallized
Voltage Rating - AC: 300V
Voltage Rating - DC: 1000V (1kV)
Height - Seated (Max): 0.728" (18.50mm)
Capacitance: 0.018 µF
Size / Dimension: 1.024" L x 0.236" W (26.00mm x 6.00mm)
Produkt ist nicht verfügbar
BFC237875183 |
Hersteller: Vishay / BC Components
Film Capacitors .018uF 5% 1000volts
Film Capacitors .018uF 5% 1000volts
Produkt ist nicht verfügbar
87518 |
Hersteller: Brady Corporation
Description: TAG BRASS RND 1.5 VAC 451-475
Packaging: Bulk
Color: Black Legend, Brass Background
Material: Brass
Label Type: VAC (Vacuum)
Label Size: 38.10mm Dia
Part Status: Active
Description: TAG BRASS RND 1.5 VAC 451-475
Packaging: Bulk
Color: Black Legend, Brass Background
Material: Brass
Label Type: VAC (Vacuum)
Label Size: 38.10mm Dia
Part Status: Active
Produkt ist nicht verfügbar
MCIMX6U6AVM08ACR |
Hersteller: NXP Semiconductors
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin MAP-BGA T/R
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin MAP-BGA T/R
Produkt ist nicht verfügbar
MCIMX6U6AVM08ACR |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
MCIMX6U6AVM08ACR |
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 800MHz, MAPBGA 624
Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 800MHz, MAPBGA 624
Produkt ist nicht verfügbar
NOSC686M006S0200 |
Hersteller: KYOCERA AVX
Description: CAP NIOB OXID 68UF 20% 6.3V 2312
Tolerance: ±20%
Features: Low ESR
Packaging: Tape & Reel (TR)
Package / Case: 2312 (6032 Metric)
Size / Dimension: 0.236" L x 0.126" W (6.00mm x 3.20mm)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Manufacturer Size Code: C
Dissipation Factor: 6%
Supplier Device Package: 2312 (6032 Metric)
Height - Seated (Max): 0.122" (3.10mm)
Capacitance: 68 µF
Voltage - Rated: 6.3 V
ESR (Equivalent Series Resistance): 200 mOhms
Current - Leakage: 8.2 µA
Description: CAP NIOB OXID 68UF 20% 6.3V 2312
Tolerance: ±20%
Features: Low ESR
Packaging: Tape & Reel (TR)
Package / Case: 2312 (6032 Metric)
Size / Dimension: 0.236" L x 0.126" W (6.00mm x 3.20mm)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Manufacturer Size Code: C
Dissipation Factor: 6%
Supplier Device Package: 2312 (6032 Metric)
Height - Seated (Max): 0.122" (3.10mm)
Capacitance: 68 µF
Voltage - Rated: 6.3 V
ESR (Equivalent Series Resistance): 200 mOhms
Current - Leakage: 8.2 µA
Produkt ist nicht verfügbar
P89LPC921FDH,518 |
Hersteller: NXP Semiconductors
MCU 8-bit 80C51 CISC 4KB Flash 2.5V/3.3V 20-Pin TSSOP T/R
MCU 8-bit 80C51 CISC 4KB Flash 2.5V/3.3V 20-Pin TSSOP T/R
Produkt ist nicht verfügbar
P89LPC921FDH,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar