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.JPG "10TRV3300M16X16.5")
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| 1393533-2 | TE Connectivity |
Category: Unclassified Description: 1393533-2 |
auf Bestellung 1250 Stücke: Lieferzeit 14-21 Tag (e) |
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| Celeron D346 2.93/533/256 | Intel | 07+ SL7SV; |
auf Bestellung 400 Stücke: Lieferzeit 21-28 Tag (e) |
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74HCT109D-Q100J | Nexperia USA Inc. |
 Description: IC FF JK TYPE DUAL 1BIT 16SOPackaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Set(Preset) and Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 81 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-SO Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF Part Status: Active Number of Bits per Element: 1 Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 146 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC823ABQ-Q100J | Nexperia USA Inc. |
Description: IC FF D-TYPE SNGL 9BIT 24DHVQFN Packaging: Bulk Package / Case: 24-VFQFN Exposed Pad Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 10 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 200 MHz Input Capacitance: 5 pF Supplier Device Package: 24-DHVQFN (5.5x3.5) Max Propagation Delay @ V, Max CL: 10ns @ 3.3V, 50pF Grade: Automotive Part Status: Obsolete Number of Bits per Element: 9 Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6U6AVM10AC | NXP USA Inc. |
Description: IC MPU I.MX6DL 1GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 212 Stücke: Lieferzeit 21-28 Tag (e) |
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PCA9540BDP/Q900J | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.3V ~ 5.5V Applications: 2-Channel I2C Multiplexer Supplier Device Package: 8-TSSOP Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2453 Stücke: Lieferzeit 21-28 Tag (e) |
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SVF311R3K2CKU2 | NXP USA Inc. |
Description: IC MPU VYBRID 266MHZ 176HLQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 21-28 Tag (e) |
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UPM2G4R7MHD1TO | Nichicon |
Description: CAP ALUM 4.7UF 20% 400V RADIAL Tolerance: ±20% Packaging: Cut Tape (CT) Package / Case: Radial, Can Size / Dimension: 0.492" Dia (12.50mm) Polarization: Polar Mounting Type: Through Hole Operating Temperature: -40°C ~ 105°C Applications: Automotive Lead Spacing: 0.197" (5.00mm) Ratings: AEC-Q200 Lifetime @ Temp.: 5000 Hrs @ 105°C Height - Seated (Max): 0.866" (22.00mm) Part Status: Not For New Designs Capacitance: 4.7 µF Voltage - Rated: 400 V Ripple Current @ Low Frequency: 55 mA @ 120 Hz Ripple Current @ High Frequency: 88 mA @ 10 kHz |
auf Bestellung 198 Stücke: Lieferzeit 21-28 Tag (e) |
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UPM2G4R7MHD1TO | Nichicon |
Description: CAP ALUM 4.7UF 20% 400V RADIAL Tolerance: ±20% Packaging: Tape & Box (TB) Package / Case: Radial, Can Size / Dimension: 0.492" Dia (12.50mm) Polarization: Polar Mounting Type: Through Hole Operating Temperature: -40°C ~ 105°C Applications: Automotive Lead Spacing: 0.197" (5.00mm) Ratings: AEC-Q200 Lifetime @ Temp.: 5000 Hrs @ 105°C Height - Seated (Max): 0.866" (22.00mm) Part Status: Not For New Designs Capacitance: 4.7 µF Voltage - Rated: 400 V Ripple Current @ Low Frequency: 55 mA @ 120 Hz Ripple Current @ High Frequency: 88 mA @ 10 kHz |
auf Bestellung 500 Stücke: Lieferzeit 21-28 Tag (e) |
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10TRV3300M16X16.5 | Rubycon |
Description: CAP ALUM 3300UF 20% 10V SMD Packaging: Cut Tape (CT) Tolerance: ±20% Package / Case: Radial, Can - SMD Size / Dimension: 0.630" Dia (16.00mm) Polarization: Polar Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Applications: General Purpose Lifetime @ Temp.: 10000 Hrs @ 105°C Surface Mount Land Size: 0.669" L x 0.669" W (17.00mm x 17.00mm) Height - Seated (Max): 0.669" (17.00mm) Capacitance: 3300 µF Voltage - Rated: 10 V Impedance: 66 mOhms Ripple Current @ Low Frequency: 870 mA @ 120 Hz Ripple Current @ High Frequency: 1.45 A @ 100 kHz |
Produkt ist nicht verfügbar |
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10TRV3300M16X16.5 | Rubycon |
Description: CAP ALUM 3300UF 20% 10V SMD Packaging: Tape & Reel (TR) Tolerance: ±20% Package / Case: Radial, Can - SMD Size / Dimension: 0.630" Dia (16.00mm) Polarization: Polar Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Applications: General Purpose Lifetime @ Temp.: 10000 Hrs @ 105°C Surface Mount Land Size: 0.669" L x 0.669" W (17.00mm x 17.00mm) Height - Seated (Max): 0.669" (17.00mm) Capacitance: 3300 µF Voltage - Rated: 10 V Impedance: 66 mOhms Ripple Current @ Low Frequency: 870 mA @ 120 Hz Ripple Current @ High Frequency: 1.45 A @ 100 kHz |
Produkt ist nicht verfügbar |
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74HCT109D-Q100J | NEXPERIA |
Flip Flop JK# -Type Pos-Edge 2-Element Automotive 16-Pin SO T/R |
Produkt ist nicht verfügbar |
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74HCT109D-Q100J | Nexperia USA Inc. |
Description: IC FF JK TYPE DUAL 1BIT 16SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Set(Preset) and Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 81 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-SO Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF Grade: Automotive Part Status: Active Number of Bits per Element: 1 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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74LVC823ABQ-Q100J | NEXPERIA |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element Automotive 24-Pin DHVQFN EP T/R |
Produkt ist nicht verfügbar |
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74LVC823ABQ-Q100J | Nexperia USA Inc. |
Description: IC FF D-TYPE SNGL 9BIT 24DHVQFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 10 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 200 MHz Input Capacitance: 5 pF Supplier Device Package: 24-DHVQFN (5.5x3.5) Max Propagation Delay @ V, Max CL: 10ns @ 3.3V, 50pF Grade: Automotive Part Status: Obsolete Number of Bits per Element: 9 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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FH8065301487717S R1X6 | Intel |
MPU Atom® Processor E3845 RISC 64bit 22nm 1.91GHz 1170-Pin FCBGA Tray |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32P | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32P(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32P(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PA | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PA(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PA(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PB | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PB(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PB(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PC | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PC(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PC(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PD | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PD(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32PD(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32S | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32S(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32S(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SA | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SA(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SA(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SB | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SB(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SB(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SC | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SC(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SC(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SD | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SD(014) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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| JTG06RP-22-32SD(023) | Amphenol Aerospace Operations |
Description: PLUG Packaging: Bulk |
Produkt ist nicht verfügbar |
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MCIMX6S1AVM10AC | NXP USA Inc. |
Description: IC MPU I.MX6S 1GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6S4AVM10AC | NXP USA Inc. |
Description: IC MPU I.MX6S 1GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6U1AVM10AC | NXP Semiconductors |
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6U4AVM10AC | NXP Semiconductors |
SOC i.MX 6DualLite ARM Cortex A9 0.04um Automotive 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6U6AVM10AC | NXP Semiconductors |
SOC i.MX 6DualLite ARMCortex A9 40nm Automotive AEC-Q100 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6Y0CVM05AA | NXP Semiconductors |
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6Y0CVM05AA | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active Additional Interfaces: I2C, SPI, UART |
Produkt ist nicht verfügbar |
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MCIMX6Y0DVM05AA | NXP Semiconductors |
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6Y0DVM05AA | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active Additional Interfaces: I2C, SPI, UART |
Produkt ist nicht verfügbar |
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MCIMX6Y1DVK05AA | NXP Semiconductors |
SOC i.MX 6ULL ARM Cortex A7 40nm 272-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6Y1DVK05AA | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 272MAPBGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: CAN, I2C, SPI, UART |
Produkt ist nicht verfügbar |
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PCA9540BDP/Q900J | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8TSSOP Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.3V ~ 5.5V Applications: 2-Channel I2C Multiplexer Supplier Device Package: 8-TSSOP Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S9S12ZVLS1F0MFM | NXP Semiconductors |
MagniV 16-bit S12Zcore Microcontroller |
Produkt ist nicht verfügbar |
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S9S12ZVLS1F0MFM | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| 1393533-2 |
auf Bestellung 1250 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 5.61 EUR |
| 90+ | 4.83 EUR |
| 400+ | 4.65 EUR |
| 1000+ | 4.48 EUR |
| Celeron D346 2.93/533/256 |
Hersteller: Intel
07+ SL7SV;
07+ SL7SV;
auf Bestellung 400 Stücke:
Lieferzeit 21-28 Tag (e)| 74HCT109D-Q100J |
|
Hersteller: Nexperia USA Inc.
Description: IC FF JK TYPE DUAL 1BIT 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 81 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 1
Grade: Automotive
Qualification: AEC-Q100
Description: IC FF JK TYPE DUAL 1BIT 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 81 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 1
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 146 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 18+ | 1.48 EUR |
| 21+ | 1.28 EUR |
| 25+ | 1.19 EUR |
| 100+ | 0.95 EUR |
| 74LVC823ABQ-Q100J |
|
Hersteller: Nexperia USA Inc.
Description: IC FF D-TYPE SNGL 9BIT 24DHVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 5 pF
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Max Propagation Delay @ V, Max CL: 10ns @ 3.3V, 50pF
Grade: Automotive
Part Status: Obsolete
Number of Bits per Element: 9
Qualification: AEC-Q100
Description: IC FF D-TYPE SNGL 9BIT 24DHVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 5 pF
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Max Propagation Delay @ V, Max CL: 10ns @ 3.3V, 50pF
Grade: Automotive
Part Status: Obsolete
Number of Bits per Element: 9
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 893+ | 0.82 EUR |
| MCIMX6U6AVM10AC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6DL 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 212 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 151.76 EUR |
| 10+ | 123.96 EUR |
| 120+ | 111.97 EUR |
| PCA9540BDP/Q900J |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2453 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 5.17 EUR |
| 10+ | 4.64 EUR |
| 25+ | 4.38 EUR |
| 100+ | 3.73 EUR |
| 250+ | 3.5 EUR |
| 500+ | 3.06 EUR |
| 1000+ | 2.54 EUR |
| SVF311R3K2CKU2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 91.18 EUR |
| 10+ | 73.12 EUR |
| UPM2G4R7MHD1TO |
|
Hersteller: Nichicon
Description: CAP ALUM 4.7UF 20% 400V RADIAL
Tolerance: ±20%
Packaging: Cut Tape (CT)
Package / Case: Radial, Can
Size / Dimension: 0.492" Dia (12.50mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: Automotive
Lead Spacing: 0.197" (5.00mm)
Ratings: AEC-Q200
Lifetime @ Temp.: 5000 Hrs @ 105°C
Height - Seated (Max): 0.866" (22.00mm)
Part Status: Not For New Designs
Capacitance: 4.7 µF
Voltage - Rated: 400 V
Ripple Current @ Low Frequency: 55 mA @ 120 Hz
Ripple Current @ High Frequency: 88 mA @ 10 kHz
Description: CAP ALUM 4.7UF 20% 400V RADIAL
Tolerance: ±20%
Packaging: Cut Tape (CT)
Package / Case: Radial, Can
Size / Dimension: 0.492" Dia (12.50mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: Automotive
Lead Spacing: 0.197" (5.00mm)
Ratings: AEC-Q200
Lifetime @ Temp.: 5000 Hrs @ 105°C
Height - Seated (Max): 0.866" (22.00mm)
Part Status: Not For New Designs
Capacitance: 4.7 µF
Voltage - Rated: 400 V
Ripple Current @ Low Frequency: 55 mA @ 120 Hz
Ripple Current @ High Frequency: 88 mA @ 10 kHz
auf Bestellung 198 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11+ | 2.44 EUR |
| 15+ | 1.84 EUR |
| 50+ | 1.68 EUR |
| 100+ | 1.38 EUR |
| UPM2G4R7MHD1TO |
|
Hersteller: Nichicon
Description: CAP ALUM 4.7UF 20% 400V RADIAL
Tolerance: ±20%
Packaging: Tape & Box (TB)
Package / Case: Radial, Can
Size / Dimension: 0.492" Dia (12.50mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: Automotive
Lead Spacing: 0.197" (5.00mm)
Ratings: AEC-Q200
Lifetime @ Temp.: 5000 Hrs @ 105°C
Height - Seated (Max): 0.866" (22.00mm)
Part Status: Not For New Designs
Capacitance: 4.7 µF
Voltage - Rated: 400 V
Ripple Current @ Low Frequency: 55 mA @ 120 Hz
Ripple Current @ High Frequency: 88 mA @ 10 kHz
Description: CAP ALUM 4.7UF 20% 400V RADIAL
Tolerance: ±20%
Packaging: Tape & Box (TB)
Package / Case: Radial, Can
Size / Dimension: 0.492" Dia (12.50mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: Automotive
Lead Spacing: 0.197" (5.00mm)
Ratings: AEC-Q200
Lifetime @ Temp.: 5000 Hrs @ 105°C
Height - Seated (Max): 0.866" (22.00mm)
Part Status: Not For New Designs
Capacitance: 4.7 µF
Voltage - Rated: 400 V
Ripple Current @ Low Frequency: 55 mA @ 120 Hz
Ripple Current @ High Frequency: 88 mA @ 10 kHz
auf Bestellung 500 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 500+ | 1.1 EUR |
| 10TRV3300M16X16.5 |
|
Hersteller: Rubycon
Description: CAP ALUM 3300UF 20% 10V SMD
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: Radial, Can - SMD
Size / Dimension: 0.630" Dia (16.00mm)
Polarization: Polar
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lifetime @ Temp.: 10000 Hrs @ 105°C
Surface Mount Land Size: 0.669" L x 0.669" W (17.00mm x 17.00mm)
Height - Seated (Max): 0.669" (17.00mm)
Capacitance: 3300 µF
Voltage - Rated: 10 V
Impedance: 66 mOhms
Ripple Current @ Low Frequency: 870 mA @ 120 Hz
Ripple Current @ High Frequency: 1.45 A @ 100 kHz
Description: CAP ALUM 3300UF 20% 10V SMD
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: Radial, Can - SMD
Size / Dimension: 0.630" Dia (16.00mm)
Polarization: Polar
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lifetime @ Temp.: 10000 Hrs @ 105°C
Surface Mount Land Size: 0.669" L x 0.669" W (17.00mm x 17.00mm)
Height - Seated (Max): 0.669" (17.00mm)
Capacitance: 3300 µF
Voltage - Rated: 10 V
Impedance: 66 mOhms
Ripple Current @ Low Frequency: 870 mA @ 120 Hz
Ripple Current @ High Frequency: 1.45 A @ 100 kHz
Produkt ist nicht verfügbar
| 10TRV3300M16X16.5 |
|
Hersteller: Rubycon
Description: CAP ALUM 3300UF 20% 10V SMD
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: Radial, Can - SMD
Size / Dimension: 0.630" Dia (16.00mm)
Polarization: Polar
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lifetime @ Temp.: 10000 Hrs @ 105°C
Surface Mount Land Size: 0.669" L x 0.669" W (17.00mm x 17.00mm)
Height - Seated (Max): 0.669" (17.00mm)
Capacitance: 3300 µF
Voltage - Rated: 10 V
Impedance: 66 mOhms
Ripple Current @ Low Frequency: 870 mA @ 120 Hz
Ripple Current @ High Frequency: 1.45 A @ 100 kHz
Description: CAP ALUM 3300UF 20% 10V SMD
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: Radial, Can - SMD
Size / Dimension: 0.630" Dia (16.00mm)
Polarization: Polar
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lifetime @ Temp.: 10000 Hrs @ 105°C
Surface Mount Land Size: 0.669" L x 0.669" W (17.00mm x 17.00mm)
Height - Seated (Max): 0.669" (17.00mm)
Capacitance: 3300 µF
Voltage - Rated: 10 V
Impedance: 66 mOhms
Ripple Current @ Low Frequency: 870 mA @ 120 Hz
Ripple Current @ High Frequency: 1.45 A @ 100 kHz
Produkt ist nicht verfügbar
| 74HCT109D-Q100J |
|
Hersteller: NEXPERIA
Flip Flop JK# -Type Pos-Edge 2-Element Automotive 16-Pin SO T/R
Flip Flop JK# -Type Pos-Edge 2-Element Automotive 16-Pin SO T/R
Produkt ist nicht verfügbar
| 74HCT109D-Q100J |
|
Hersteller: Nexperia USA Inc.
Description: IC FF JK TYPE DUAL 1BIT 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 81 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Grade: Automotive
Part Status: Active
Number of Bits per Element: 1
Qualification: AEC-Q100
Description: IC FF JK TYPE DUAL 1BIT 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 81 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Grade: Automotive
Part Status: Active
Number of Bits per Element: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| 74LVC823ABQ-Q100J |
|
Hersteller: NEXPERIA
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element Automotive 24-Pin DHVQFN EP T/R
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element Automotive 24-Pin DHVQFN EP T/R
Produkt ist nicht verfügbar
| 74LVC823ABQ-Q100J |
|
Hersteller: Nexperia USA Inc.
Description: IC FF D-TYPE SNGL 9BIT 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 5 pF
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Max Propagation Delay @ V, Max CL: 10ns @ 3.3V, 50pF
Grade: Automotive
Part Status: Obsolete
Number of Bits per Element: 9
Qualification: AEC-Q100
Description: IC FF D-TYPE SNGL 9BIT 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 5 pF
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Max Propagation Delay @ V, Max CL: 10ns @ 3.3V, 50pF
Grade: Automotive
Part Status: Obsolete
Number of Bits per Element: 9
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| FH8065301487717S R1X6 |
|
Hersteller: Intel
MPU Atom® Processor E3845 RISC 64bit 22nm 1.91GHz 1170-Pin FCBGA Tray
MPU Atom® Processor E3845 RISC 64bit 22nm 1.91GHz 1170-Pin FCBGA Tray
Produkt ist nicht verfügbar
| JTG06RP-22-32P |
Produkt ist nicht verfügbar
| JTG06RP-22-32P(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32P(023) |
Produkt ist nicht verfügbar
| JTG06RP-22-32PA |
Produkt ist nicht verfügbar
| JTG06RP-22-32PA(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32PA(023) |
Produkt ist nicht verfügbar
| JTG06RP-22-32PB |
Produkt ist nicht verfügbar
| JTG06RP-22-32PB(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32PB(023) |
Produkt ist nicht verfügbar
| JTG06RP-22-32PC |
Produkt ist nicht verfügbar
| JTG06RP-22-32PC(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32PC(023) |
Produkt ist nicht verfügbar
| JTG06RP-22-32PD |
Produkt ist nicht verfügbar
| JTG06RP-22-32PD(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32PD(023) |
Produkt ist nicht verfügbar
| JTG06RP-22-32S |
Produkt ist nicht verfügbar
| JTG06RP-22-32S(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32S(023) |
Produkt ist nicht verfügbar
| JTG06RP-22-32SA |
Produkt ist nicht verfügbar
| JTG06RP-22-32SA(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32SA(023) |
Produkt ist nicht verfügbar
| JTG06RP-22-32SB |
Produkt ist nicht verfügbar
| JTG06RP-22-32SB(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32SB(023) |
Produkt ist nicht verfügbar
| JTG06RP-22-32SC |
Produkt ist nicht verfügbar
| JTG06RP-22-32SC(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32SC(023) |
Produkt ist nicht verfügbar
| JTG06RP-22-32SD |
Produkt ist nicht verfügbar
| JTG06RP-22-32SD(014) |
Produkt ist nicht verfügbar
| JTG06RP-22-32SD(023) |
Produkt ist nicht verfügbar
| MCIMX6S1AVM10AC |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX6S4AVM10AC |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX6U1AVM10AC |
|
Hersteller: NXP Semiconductors
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6U4AVM10AC |
|
Hersteller: NXP Semiconductors
SOC i.MX 6DualLite ARM Cortex A9 0.04um Automotive 624-Pin LFBGA Tray
SOC i.MX 6DualLite ARM Cortex A9 0.04um Automotive 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6U6AVM10AC |
|
Hersteller: NXP Semiconductors
SOC i.MX 6DualLite ARMCortex A9 40nm Automotive AEC-Q100 624-Pin LFBGA Tray
SOC i.MX 6DualLite ARMCortex A9 40nm Automotive AEC-Q100 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6Y0CVM05AA |
|
Hersteller: NXP Semiconductors
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin LFBGA Tray
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6Y0CVM05AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar
| MCIMX6Y0DVM05AA |
|
Hersteller: NXP Semiconductors
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin MAP-BGA Tray
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin MAP-BGA Tray
Produkt ist nicht verfügbar
| MCIMX6Y0DVM05AA |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar
| MCIMX6Y1DVK05AA |
|
Hersteller: NXP Semiconductors
SOC i.MX 6ULL ARM Cortex A7 40nm 272-Pin MAP-BGA Tray
SOC i.MX 6ULL ARM Cortex A7 40nm 272-Pin MAP-BGA Tray
Produkt ist nicht verfügbar
| MCIMX6Y1DVK05AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
| PCA9540BDP/Q900J |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| S9S12ZVLS1F0MFM |
|
Hersteller: NXP Semiconductors
MagniV 16-bit S12Zcore Microcontroller
MagniV 16-bit S12Zcore Microcontroller
Produkt ist nicht verfügbar
| S9S12ZVLS1F0MFM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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