Technische Details BTFW30R-3RSTE1LF AFCI
Description: CONN RCPT 30POS R/A SMD TIN, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Right Angle, Number of Positions: 30, Pitch: 0.039" (1.00mm), Height Above Board: 0.299" (7.60mm), Number of Rows: 2.
Weitere Produktangebote BTFW30R-3RSTE1LF
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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BTFW30R-3RSTE1LF | Hersteller : FCI |
 Conn Board to Board RCP 30 POS 1mm Solder RA SMD T/R |
Produkt ist nicht verfügbar |
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| BTFW30R-3RSTE1LF | Hersteller : Amphenol ICC (FCI) |
 Description: CONN RCPT 30POS R/A SMD TINPackaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount, Right Angle Number of Positions: 30 Pitch: 0.039" (1.00mm) Height Above Board: 0.299" (7.60mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |