BU200Z-178-HT On-Shore Technology, Inc
auf Bestellung 387 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 312+ | 0.51 EUR |
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Technische Details BU200Z-178-HT On-Shore Technology, Inc
Description: CONN IC DIP SOCKET 20POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 78.7µin (2.00µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Copper, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Brass, Part Status: Obsolete.
Weitere Produktangebote BU200Z-178-HT nach Preis ab 0.51 EUR bis 0.51 EUR
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BU200Z-178-HT | Hersteller : On-Shore Technology, Inc |
 Conn DIP Socket SKT 20 POS 2.54mm Solder ST SMD |
auf Bestellung 387 Stücke: Lieferzeit 14-21 Tag (e) |
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BU200Z-178-HT | Hersteller : On Shore Technology Inc. |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 78.7µin (2.00µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Copper Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
Produkt ist nicht verfügbar |