Technische Details ECHU1H183GB5 PAN
Description: CAP FILM 0.018UF 2% 50VDC 1210, Packaging: Tape & Reel (TR), Tolerance: ±2%, Package / Case: 1210 (3225 Metric), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 125°C, Applications: General Purpose, Termination: Solder Pads, Dielectric Material: Polyphenylene Sulfide (PPS), Metallized - Stacked, Voltage Rating - DC: 50V, Height - Seated (Max): 0.063" (1.60mm), Part Status: Active, Capacitance: 0.018 µF, Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm).
Weitere Produktangebote ECHU1H183GB5
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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| ECHU1H183GB5 | Hersteller : PANASONIC |
auf Bestellung 1790 Stücke: Lieferzeit 21-28 Tag (e) |
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ECH-U1H183GB5 | Hersteller : Panasonic Electronic Components |
 Description: CAP FILM 0.018UF 2% 50VDC 1210Packaging: Tape & Reel (TR) Tolerance: ±2% Package / Case: 1210 (3225 Metric) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Applications: General Purpose Termination: Solder Pads Dielectric Material: Polyphenylene Sulfide (PPS), Metallized - Stacked Voltage Rating - DC: 50V Height - Seated (Max): 0.063" (1.60mm) Part Status: Active Capacitance: 0.018 µF Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Produkt ist nicht verfügbar |
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ECH-U1H183GB5 | Hersteller : Panasonic Electronic Components |
Description: CAP FILM 0.018UF 2% 50VDC 1210 Packaging: Cut Tape (CT) Tolerance: ±2% Package / Case: 1210 (3225 Metric) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Applications: General Purpose Termination: Solder Pads Dielectric Material: Polyphenylene Sulfide (PPS), Metallized - Stacked Voltage Rating - DC: 50V Height - Seated (Max): 0.063" (1.60mm) Part Status: Active Capacitance: 0.018 µF Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Produkt ist nicht verfügbar |
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ECH-U1H183GB5 | Hersteller : Panasonic |
Film Capacitors 0.018uF 50VDC 2% PPS FILM 1210 |
Produkt ist nicht verfügbar |