ED08DT

ED08DT

Hersteller:
DIP-8 CONN IC DIP SOCKET 8POS TIN 2.54MM Phosphor Bronze
ipg2.pdf
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Technische Details ED08DT

Description: CONN IC DIP SOCKET 8POS TIN, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 110°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Part Status: Active.

Preis ED08DT ab 0 EUR bis 0 EUR

ED08DT
ED08DT
Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 110°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
ipg2.pdf
auf Bestellung 25438 Stücke
Lieferzeit 21-28 Tag (e)