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FI-X30SSLA-HF

FI-X30SSLA-HF JAE Electronics


JAEIS04316_1-2550442.pdf Hersteller: JAE Electronics
FFC & FPC Connectors CONN FPC RCP 30POS 1MM SLDR RA SMD
auf Bestellung 745 Stücke:

Lieferzeit 149-163 Tag (e)
Anzahl Preis ohne MwSt
1+52 EUR
5+ 49.17 EUR
10+ 46.93 EUR
25+ 44.95 EUR
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Technische Details FI-X30SSLA-HF JAE Electronics

Description: CONN RCPT 30P 0.039 GOLD SMD R/A, Features: Grounding Pins, Shielded, Solder Retention, Packaging: Strip, Connector Type: Receptacle, Voltage Rating: 200V, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 30, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 80°C, Contact Type: Non-Gendered, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish - Post: Tin, Part Status: Obsolete, Insulation Height: 0.091" (2.30mm), Number of Rows: 1.

Weitere Produktangebote FI-X30SSLA-HF

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FI-X30SSLA-HF FI-X30SSLA-HF Hersteller : JAE Electronics topics_id=65274&ext_no=06&index=0&_lang=en Description: CONN RCPT 30P 0.039 GOLD SMD R/A
Features: Grounding Pins, Shielded, Solder Retention
Packaging: Strip
Connector Type: Receptacle
Voltage Rating: 200V
Current Rating (Amps): 1A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 80°C
Contact Type: Non-Gendered
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Beige
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin
Part Status: Obsolete
Insulation Height: 0.091" (2.30mm)
Number of Rows: 1
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