FI-X30SSLA-HF JAE Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 41.89 EUR |
| 5+ | 39.6 EUR |
| 10+ | 37.81 EUR |
| 25+ | 36.21 EUR |
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Technische Details FI-X30SSLA-HF JAE Electronics
Description: CONN RCPT 30P 0.039 GOLD SMD R/A, Packaging: Strip, Features: Grounding Pins, Shielded, Solder Retention, Connector Type: Receptacle, Voltage Rating: 200V, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 30, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 80°C, Contact Type: Non-Gendered, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish - Post: Tin, Part Status: Obsolete, Insulation Height: 0.091" (2.30mm), Number of Rows: 1.
Weitere Produktangebote FI-X30SSLA-HF nach Preis ab 36.12 EUR bis 47.47 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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FI-X30SSLA-HF | Japan Aviation Electronics Ind |
 Conn Wire to Board RCP 30 POS 1mm Solder RA SMD T/R |
auf Bestellung 30 Stücke: Lieferzeit 14-21 Tag (e) |
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| FI-X30SSLA-HF |
|
Hersteller: Japan Aviation Electronics Ind
Conn Wire to Board RCP 30 POS 1mm Solder RA SMD T/R
Conn Wire to Board RCP 30 POS 1mm Solder RA SMD T/R
auf Bestellung 30 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 47.47 EUR |
| 10+ | 40.4 EUR |
| 25+ | 36.12 EUR |