GD30MPS12H

GD30MPS12H GeneSiC Semiconductor


GD30MPS12H.pdf Hersteller: GeneSiC Semiconductor
Description: DIODE SIL CARB 1.2KV 55A TO247-2
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1101pF @ 1V, 1MHz
Current - Average Rectified (Io): 55A
Supplier Device Package: TO-247-2
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 30 A
Current - Reverse Leakage @ Vr: 20 µA @ 1200 V
auf Bestellung 505 Stücke:

Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+23.71 EUR
10+ 21.32 EUR
25+ 20.43 EUR
100+ 19.18 EUR
250+ 18.37 EUR
500+ 17.79 EUR
Mindestbestellmenge: 2
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Technische Details GD30MPS12H GeneSiC Semiconductor

Description: DIODE SIL CARB 1.2KV 55A TO247-2, Packaging: Tube, Package / Case: TO-247-2, Mounting Type: Through Hole, Speed: Fast Recovery =< 500ns, > 200mA (Io), Technology: SiC (Silicon Carbide) Schottky, Capacitance @ Vr, F: 1101pF @ 1V, 1MHz, Current - Average Rectified (Io): 55A, Supplier Device Package: TO-247-2, Operating Temperature - Junction: -55°C ~ 175°C, Part Status: Active, Voltage - DC Reverse (Vr) (Max): 1200 V, Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 30 A, Current - Reverse Leakage @ Vr: 20 µA @ 1200 V.