LPC2106FHN48/01 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
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Technische Details LPC2106FHN48/01 NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 48HVQFN, Packaging: Bulk, Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Speed: 60MHz, Program Memory Size: 128KB (128K x 8), RAM Size: 64K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM7®, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V, Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: POR, PWM, WDT, Supplier Device Package: 48-HVQFN (7x7), Part Status: Active, Number of I/O: 32.