PA0212 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSOP-66 II TO DIP-66 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm)
Material: FR4 Epoxy Glass
Number of Positions: 66
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: TSOP-66 II TO DIP-66 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm)
Material: FR4 Epoxy Glass
Number of Positions: 66
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
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Technische Details PA0212 Chip Quik Inc.
Description: TSOP-66 II TO DIP-66 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm), Material: FR4 Epoxy Glass, Number of Positions: 66, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TSOP.
Weitere Produktangebote PA0212
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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PA0212 | Hersteller : Chip Quik | Sockets & Adapters TSOP-66 (II) to DIP-66 SMT Adapter |
Produkt ist nicht verfügbar |