Suchergebnisse für "PLS-16" : 40

Art der Ansicht :
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
ohne MwSt
PLS167AF PHI 90 DIP24
auf Bestellung 129 Stücke:
Lieferzeit 21-28 Tag (e)
PLS167AN
auf Bestellung 357 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168 PHI DIP24
auf Bestellung 33 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168/BLA PHI 91 DIP24
auf Bestellung 47 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168/BLA S CDIP
auf Bestellung 5000 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AA PHILPS PLCC28
auf Bestellung 108 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AF PHI 91 DIP24
auf Bestellung 284 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AF PHIL 9035+ DIP-24;
auf Bestellung 143 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AN PHI DIP24
auf Bestellung 132 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AN PHILIPS 97+
auf Bestellung 89 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AN PHI 09+ .
auf Bestellung 332 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168N PHI DIP24
auf Bestellung 14 Stücke:
Lieferzeit 21-28 Tag (e)
DPLS160-7 DPLS160-7 Diodes Incorporated ds31389.pdf Description: TRANS PNP 60V 1A SOT23-3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Frequency - Transition: 150MHz
Supplier Device Package: SOT-23-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 60000 Stücke:
Lieferzeit 21-28 Tag (e)
3000+0.23 EUR
9000+ 0.2 EUR
Mindestbestellmenge: 3000
DPLS160-7 DPLS160-7 Diodes Incorporated ds31389.pdf Description: TRANS PNP 60V 1A SOT23-3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Frequency - Transition: 150MHz
Supplier Device Package: SOT-23-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 62925 Stücke:
Lieferzeit 21-28 Tag (e)
25+1.07 EUR
35+ 0.75 EUR
100+ 0.38 EUR
500+ 0.34 EUR
1000+ 0.26 EUR
Mindestbestellmenge: 25
DPLS160-7 DPLS160-7 Diodes Incorporated ds31389.pdf Description: TRANS PNP 60V 1A SOT23-3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Frequency - Transition: 150MHz
Supplier Device Package: SOT-23-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 60009 Stücke:
Lieferzeit 21-28 Tag (e)
25+1.07 EUR
Mindestbestellmenge: 25
DPLS160V-7 DPLS160V-7 Diodes Incorporated ds31251.pdf Description: TRANS PNP 60V 1A SOT563
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 500mA, 5V
Frequency - Transition: 220MHz
Supplier Device Package: SOT-563
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 63000 Stücke:
Lieferzeit 21-28 Tag (e)
3000+0.23 EUR
6000+ 0.22 EUR
9000+ 0.2 EUR
30000+ 0.19 EUR
Mindestbestellmenge: 3000
DPLS160V-7 DPLS160V-7 Diodes Incorporated ds31251.pdf Description: TRANS PNP 60V 1A SOT563
Packaging: Cut Tape (CT)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 500mA, 5V
Frequency - Transition: 220MHz
Supplier Device Package: SOT-563
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 63000 Stücke:
Lieferzeit 21-28 Tag (e)
32+0.83 EUR
40+ 0.66 EUR
100+ 0.39 EUR
500+ 0.36 EUR
1000+ 0.25 EUR
Mindestbestellmenge: 32
CMPLS168 PHI DIP24
auf Bestellung 40 Stücke:
Lieferzeit 21-28 Tag (e)
RBPLS168 PHI DIP24
auf Bestellung 31 Stücke:
Lieferzeit 21-28 Tag (e)
112-A-SS16G NINGBO XINYA UNITED TECH.CO., LTD. PLS-16 Штыри в плату 1-х рядн. шаг 2.54м позолоченные
auf Bestellung 99 Stücke:
Lieferzeit 14-21 Tag (e)
KLS1-207-1-16-S NINGBO KLS IMP&EXP CO.,LTD. PLS-16 Штыри в плату 1-х рядн. шаг 2.54м позолоченные
auf Bestellung 2640 Stücke:
Lieferzeit 14-21 Tag (e)
L-KLS1-207-1-16-S-3.0*3.0*8.5 NINGBO KLS IMP&EXP CO.,LTD. PLS-16 30мм Штыри в плату 1-х рядн. шаг 2.54м позолоченные 30мм
auf Bestellung 1900 Stücke:
Lieferzeit 14-21 Tag (e)
ZL201-16G NINGBO CONNFLY ELECTRONIC CO., LTD PLS-16 Штыри в плату 1-х рядн. шаг 2.54м позолоченные
auf Bestellung 30 Stücke:
Lieferzeit 14-21 Tag (e)
PLS16-A120-CA Visual Communications Company - VCC Description: 16MM PILOT LIGHT AND LED REPLACE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PLS16-B120-CB Visual Communications Company - VCC Description: PILOT LIGHT BLUE 120V WITH LED L
Packaging: Bag
Voltage: 120V
Type: LED
Lens Color: Blue
Ratings: AC/DC
Lamp Color: Blue
Part Status: Active
Produkt ist nicht verfügbar
PLS16-G120-CG Visual Communications Company - VCC Description: 16MM PILOT LIGHT AND LED REPLACE
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
PLS16-W120-CW Visual Communications Company - VCC Description: 16MM PILOT LIGHT AND LED REPLACE
Packaging: Bulk
Part Status: Not For New Designs
Produkt ist nicht verfügbar
156-PLS16011-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
172-PLS16002-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
229-PLS16014-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
256-PLS16001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
30-PLS16017-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
30-PLS16018-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
30-PLS16020-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
30-PLS16022-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
47-PLS16021-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
64-PLS16016-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
AFS4-11501380-45-15P-LS1-6 L3 Narda-MITEQ Description: TADIRAN
Packaging: Box
Part Status: Active
Produkt ist nicht verfügbar
DPLS160-7 DPLS160-7 Diodes Inc ds31389.pdf Trans GP BJT PNP 60V 1A 300mW 3-Pin SOT-23 T/R
Produkt ist nicht verfügbar
DPLS160V-7 DPLS160V-7 Diodes Inc ds31251.pdf Trans GP BJT PNP 60V 1A 300mW 6-Pin SOT-563 T/R
Produkt ist nicht verfügbar
PLS167AF
Hersteller: PHI
90 DIP24
auf Bestellung 129 Stücke:
Lieferzeit 21-28 Tag (e)
PLS167AN
auf Bestellung 357 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168
Hersteller: PHI
DIP24
auf Bestellung 33 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168/BLA
Hersteller: PHI
91 DIP24
auf Bestellung 47 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168/BLA
Hersteller: S
CDIP
auf Bestellung 5000 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AA
Hersteller: PHILPS
PLCC28
auf Bestellung 108 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AF
Hersteller: PHI
91 DIP24
auf Bestellung 284 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AF
Hersteller: PHIL
9035+ DIP-24;
auf Bestellung 143 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AN
Hersteller: PHI
DIP24
auf Bestellung 132 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AN
Hersteller: PHILIPS
97+
auf Bestellung 89 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168AN
Hersteller: PHI
09+ .
auf Bestellung 332 Stücke:
Lieferzeit 21-28 Tag (e)
PLS168N
Hersteller: PHI
DIP24
auf Bestellung 14 Stücke:
Lieferzeit 21-28 Tag (e)
DPLS160-7 ds31389.pdf
DPLS160-7
Hersteller: Diodes Incorporated
Description: TRANS PNP 60V 1A SOT23-3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Frequency - Transition: 150MHz
Supplier Device Package: SOT-23-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 60000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3000+0.23 EUR
9000+ 0.2 EUR
Mindestbestellmenge: 3000
DPLS160-7 ds31389.pdf
DPLS160-7
Hersteller: Diodes Incorporated
Description: TRANS PNP 60V 1A SOT23-3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Frequency - Transition: 150MHz
Supplier Device Package: SOT-23-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 62925 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
25+1.07 EUR
35+ 0.75 EUR
100+ 0.38 EUR
500+ 0.34 EUR
1000+ 0.26 EUR
Mindestbestellmenge: 25
DPLS160-7 ds31389.pdf
DPLS160-7
Hersteller: Diodes Incorporated
Description: TRANS PNP 60V 1A SOT23-3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Frequency - Transition: 150MHz
Supplier Device Package: SOT-23-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 60009 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
25+1.07 EUR
Mindestbestellmenge: 25
DPLS160V-7 ds31251.pdf
DPLS160V-7
Hersteller: Diodes Incorporated
Description: TRANS PNP 60V 1A SOT563
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 500mA, 5V
Frequency - Transition: 220MHz
Supplier Device Package: SOT-563
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 63000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3000+0.23 EUR
6000+ 0.22 EUR
9000+ 0.2 EUR
30000+ 0.19 EUR
Mindestbestellmenge: 3000
DPLS160V-7 ds31251.pdf
DPLS160V-7
Hersteller: Diodes Incorporated
Description: TRANS PNP 60V 1A SOT563
Packaging: Cut Tape (CT)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -55°C ~ 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 330mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 500mA, 5V
Frequency - Transition: 220MHz
Supplier Device Package: SOT-563
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 300 mW
auf Bestellung 63000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
32+0.83 EUR
40+ 0.66 EUR
100+ 0.39 EUR
500+ 0.36 EUR
1000+ 0.25 EUR
Mindestbestellmenge: 32
CMPLS168
Hersteller: PHI
DIP24
auf Bestellung 40 Stücke:
Lieferzeit 21-28 Tag (e)
RBPLS168
Hersteller: PHI
DIP24
auf Bestellung 31 Stücke:
Lieferzeit 21-28 Tag (e)
112-A-SS16G
Hersteller: NINGBO XINYA UNITED TECH.CO., LTD.
PLS-16 Штыри в плату 1-х рядн. шаг 2.54м позолоченные
auf Bestellung 99 Stücke:
Lieferzeit 14-21 Tag (e)
KLS1-207-1-16-S
Hersteller: NINGBO KLS IMP&EXP CO.,LTD.
PLS-16 Штыри в плату 1-х рядн. шаг 2.54м позолоченные
auf Bestellung 2640 Stücke:
Lieferzeit 14-21 Tag (e)
L-KLS1-207-1-16-S-3.0*3.0*8.5
Hersteller: NINGBO KLS IMP&EXP CO.,LTD.
PLS-16 30мм Штыри в плату 1-х рядн. шаг 2.54м позолоченные 30мм
auf Bestellung 1900 Stücke:
Lieferzeit 14-21 Tag (e)
ZL201-16G
Hersteller: NINGBO CONNFLY ELECTRONIC CO., LTD
PLS-16 Штыри в плату 1-х рядн. шаг 2.54м позолоченные
auf Bestellung 30 Stücke:
Lieferzeit 14-21 Tag (e)
PLS16-A120-CA
Hersteller: Visual Communications Company - VCC
Description: 16MM PILOT LIGHT AND LED REPLACE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PLS16-B120-CB
Hersteller: Visual Communications Company - VCC
Description: PILOT LIGHT BLUE 120V WITH LED L
Packaging: Bag
Voltage: 120V
Type: LED
Lens Color: Blue
Ratings: AC/DC
Lamp Color: Blue
Part Status: Active
Produkt ist nicht verfügbar
PLS16-G120-CG
Hersteller: Visual Communications Company - VCC
Description: 16MM PILOT LIGHT AND LED REPLACE
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
PLS16-W120-CW
Hersteller: Visual Communications Company - VCC
Description: 16MM PILOT LIGHT AND LED REPLACE
Packaging: Bulk
Part Status: Not For New Designs
Produkt ist nicht verfügbar
156-PLS16011-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
172-PLS16002-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
229-PLS16014-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
256-PLS16001-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
30-PLS16017-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
30-PLS16018-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
30-PLS16020-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
30-PLS16022-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
47-PLS16021-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
64-PLS16016-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
AFS4-11501380-45-15P-LS1-6
Hersteller: L3 Narda-MITEQ
Description: TADIRAN
Packaging: Box
Part Status: Active
Produkt ist nicht verfügbar
DPLS160-7 ds31389.pdf
DPLS160-7
Hersteller: Diodes Inc
Trans GP BJT PNP 60V 1A 300mW 3-Pin SOT-23 T/R
Produkt ist nicht verfügbar
DPLS160V-7 ds31251.pdf
DPLS160V-7
Hersteller: Diodes Inc
Trans GP BJT PNP 60V 1A 300mW 6-Pin SOT-563 T/R
Produkt ist nicht verfügbar