S9S12GN32F1MLCR,528 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, HCS12 C
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
Description: MICROCONTROLLER, 16 BIT, HCS12 C
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
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Technische Details S9S12GN32F1MLCR,528 NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, HCS12 C, Packaging: Bulk, Package / Case: 32-LQFP, Mounting Type: Surface Mount, Speed: 25MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 2K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 1K x 8, Core Processor: 12V1, Data Converters: A/D 8x10b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V, Connectivity: IrDA, LINbus, SCI, SPI, Peripherals: LVD, POR, PWM, WDT, Supplier Device Package: 32-LQFP (7x7), Part Status: Active, Number of I/O: 26.