SPC5777CK2MME3 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
DigiKey Programmable: Not Verified
auf Bestellung 32 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 134.68 EUR |
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Technische Details SPC5777CK2MME3 NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA, Packaging: Tray, Package / Case: 416-BGA, Mounting Type: Surface Mount, Speed: 264MHz, Program Memory Size: 8MB (8M x 8), RAM Size: 512K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: e200z7, Data Converters: A/D 16b Sigma-Delta, eQADC, Core Size: 32-Bit Tri-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI, Peripherals: DMA, LVD, POR, Zipwire, Supplier Device Package: 416-MAPBGA (27x27), DigiKey Programmable: Not Verified.
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