ACA-SPI-004-K01 LOTES
Hersteller: LOTESDescription: SPI 8 PIN_IC 208mil
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 2090 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 33.39 EUR |
| 50+ | 16.69 EUR |
| 100+ | 10.02 EUR |
| 200+ | 6.68 EUR |
| 700+ | 3.34 EUR |
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Technische Details ACA-SPI-004-K01 LOTES
Description: SPI 8 PIN_IC 208mil, Packaging: Tape & Reel (TR), Features: Board Guide, Closed Frame, Mounting Type: Surface Mount, Type: SOIC, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 1.00µin (0.025µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 1.00µin (0.025µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.