Suchergebnisse für "ae1004" : 24
Art der Ansicht :
Mindestbestellmenge: 2
Mindestbestellmenge: 9
Mindestbestellmenge: 8
Mindestbestellmenge: 5
Mindestbestellmenge: 4
Mindestbestellmenge: 3
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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DSC1001AE1-004.0000 | Microchip Technology | Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C |
auf Bestellung 868 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC1001AE1-004.0000 | Microchip Technology |
Description: MEMS OSC XO 4.0000MHZ CMOS SMD Packaging: Tube Package / Case: 4-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 1.8V ~ 3.3V Ratings: AEC-Q100 Current - Supply (Max): 6.5mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 4 MHz Base Resonator: MEMS |
auf Bestellung 309 Stücke: Lieferzeit 10-14 Tag (e) |
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HAE100-48S12W | P-DUKE Technology |
Description: DC DC CONVERTER 12V 101W Packaging: Box Features: Adjustable Output, Remote On/Off, Remote Sense Package / Case: Half Brick Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm) Mounting Type: Through Hole Type: Isolated Module Operating Temperature: -40°C ~ 105°C Applications: ITE (Commercial) Voltage - Input (Max): 75V Approval Agency: CB, CE, cURus Efficiency: 90% Current - Output (Max): 8.4A Supplier Device Package: Half Brick Voltage - Input (Min): 16.5V Voltage - Output 1: 12V Control Features: Enable, Active Low Power (Watts): 101 W Number of Outputs: 1 Voltage - Isolation: 3 kV |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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HAE100-48S24W | P-DUKE Technology |
Description: DC DC CONVERTER 24V 101W Packaging: Bulk Features: Adjustable Output, Baseplate, Remote On/Off, Remote Sense Package / Case: Half Brick Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm) Mounting Type: Through Hole Type: Isolated Module Operating Temperature: -40°C ~ 105°C (With Derating) Applications: ITE (Commercial) Voltage - Input (Max): 75V Approval Agency: CB, CE, cURus Efficiency: 90% Current - Output (Max): 4.2A Supplier Device Package: Half Brick Voltage - Input (Min): 16.5V Voltage - Output 1: 24V Control Features: Enable, Active Low Part Status: Active Power (Watts): 101 W Number of Outputs: 1 Voltage - Isolation: 3 kV Standard Number: 60950-1 |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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AR 08-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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AR 14-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 2798 Stücke: Lieferzeit 10-14 Tag (e) |
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AR 16-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 16POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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AR 28-HZL/07-TT | Assmann WSW Components |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC1001AE1-004.0000 | Microchip Technology |
Description: MEMS OSC XO 4.0000MHZ CMOS SMD Packaging: Strip Package / Case: 4-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 1.7V ~ 3.6V Ratings: AEC-Q100 Current - Supply (Max): 8mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 4 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1001AE1-004.0000T | Microchip Technology |
Description: MEMS OSC XO 4.0000MHZ CMOS SMD Packaging: Strip Package / Case: 4-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 1.8V ~ 3.3V Current - Supply (Max): 8mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 4 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1001AE1-004.0000T | Microchip Technology | Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C |
Produkt ist nicht verfügbar |
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DSC1121AE1-004.0000 | Microchip Technology |
Description: MEMS OSCILLATOR LOW JITTER Packaging: Tube Package / Case: 6-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 35mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 4 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1121AE1-004.0000 | Microchip Technology | Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm |
Produkt ist nicht verfügbar |
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DSC1121AE1-004.0000T | Microchip Technology |
Description: MEMS OSCILLATOR LOW JITTER Packaging: Strip Package / Case: 6-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 35mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 4 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1121AE1-004.0000T | Microchip Technology | Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm |
Produkt ist nicht verfügbar |
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Si5386A-E10044-GM | Skyworks Solutions, Inc. | Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier |
Produkt ist nicht verfügbar |
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Si5386A-E10044-GMR | Skyworks Solutions, Inc. | Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier |
Produkt ist nicht verfügbar |
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AK140-2 | Assmann WSW Components |
Description: CABLE CENTRONICS M-F 2M Packaging: Bag Length: 6.56' (2.00m) Shielding: Shielded Style: Bidirectional Configuration: Centronics 36 pos Female to Male Cable Type: Round, Beige |
Produkt ist nicht verfügbar |
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AR 18-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 18POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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AR 24-HZL/07/7-TT | Assmann WSW Components |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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AR 28-HZL/07/7-TT | Assmann WSW Components |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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AR 32-HZL/07-TT | Assmann WSW Components |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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AR 40-HZL/07-TT | Assmann WSW Components |
Description: CONN IC DIP SOCKET 40POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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AR 48-HZL/07-TT | Assmann WSW Components |
Description: CONN IC DIP SOCKET 48POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
DSC1001AE1-004.0000 |
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
auf Bestellung 868 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 1.81 EUR |
DSC1001AE1-004.0000 |
Hersteller: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.5mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.5mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 2.18 EUR |
25+ | 1.81 EUR |
100+ | 1.75 EUR |
HAE100-48S12W |
Hersteller: P-DUKE Technology
Description: DC DC CONVERTER 12V 101W
Packaging: Box
Features: Adjustable Output, Remote On/Off, Remote Sense
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 8.4A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 12V
Control Features: Enable, Active Low
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
Description: DC DC CONVERTER 12V 101W
Packaging: Box
Features: Adjustable Output, Remote On/Off, Remote Sense
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 8.4A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 12V
Control Features: Enable, Active Low
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 244.38 EUR |
HAE100-48S24W |
Hersteller: P-DUKE Technology
Description: DC DC CONVERTER 24V 101W
Packaging: Bulk
Features: Adjustable Output, Baseplate, Remote On/Off, Remote Sense
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C (With Derating)
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 4.2A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 24V
Control Features: Enable, Active Low
Part Status: Active
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
Standard Number: 60950-1
Description: DC DC CONVERTER 24V 101W
Packaging: Bulk
Features: Adjustable Output, Baseplate, Remote On/Off, Remote Sense
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C (With Derating)
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 4.2A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 24V
Control Features: Enable, Active Low
Part Status: Active
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
Standard Number: 60950-1
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 244.38 EUR |
AR 08-HZW/TN |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.43 EUR |
10+ | 2.1 EUR |
25+ | 2.01 EUR |
60+ | 1.97 EUR |
120+ | 1.88 EUR |
AR 14-HZW/TN |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 2798 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 4.24 EUR |
10+ | 3.69 EUR |
34+ | 3.53 EUR |
68+ | 3.45 EUR |
102+ | 3.3 EUR |
272+ | 2.98 EUR |
510+ | 2.75 EUR |
1020+ | 2.35 EUR |
2516+ | 2.2 EUR |
AR 16-HZW/TN |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.49 EUR |
10+ | 4.07 EUR |
AR 28-HZL/07-TT |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.49 EUR |
DSC1001AE1-004.0000 |
Hersteller: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1001AE1-004.0000T |
Hersteller: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1001AE1-004.0000T |
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
Produkt ist nicht verfügbar
DSC1121AE1-004.0000 |
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR LOW JITTER
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Description: MEMS OSCILLATOR LOW JITTER
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1121AE1-004.0000 |
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
DSC1121AE1-004.0000T |
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR LOW JITTER
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Description: MEMS OSCILLATOR LOW JITTER
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1121AE1-004.0000T |
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
Si5386A-E10044-GM |
Hersteller: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
Si5386A-E10044-GMR |
Hersteller: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
AK140-2 |
Hersteller: Assmann WSW Components
Description: CABLE CENTRONICS M-F 2M
Packaging: Bag
Length: 6.56' (2.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
Description: CABLE CENTRONICS M-F 2M
Packaging: Bag
Length: 6.56' (2.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
Produkt ist nicht verfügbar
AR 18-HZW/TN |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 24-HZL/07/7-TT |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 28-HZL/07/7-TT |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 32-HZL/07-TT |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 40-HZL/07-TT |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 48-HZL/07-TT |
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar