Suchergebnisse für "ae1004" : 24

Art der Ansicht :
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
ohne MwSt
DSC1001AE1-004.0000 DSC1001AE1-004.0000 Microchip Technology DSC1001_3_4_1_8V_3_3V_Low_Power_Precision_CMOS_Osc-3314582.pdf Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
auf Bestellung 868 Stücke:
Lieferzeit 10-14 Tag (e)
2+1.81 EUR
Mindestbestellmenge: 2
DSC1001AE1-004.0000 DSC1001AE1-004.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.5mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.18 EUR
25+ 1.81 EUR
100+ 1.75 EUR
Mindestbestellmenge: 9
HAE100-48S12W HAE100-48S12W P-DUKE Technology hae100w_datasheet.pdf Description: DC DC CONVERTER 12V 101W
Packaging: Box
Features: Adjustable Output, Remote On/Off, Remote Sense
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 8.4A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 12V
Control Features: Enable, Active Low
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+244.38 EUR
HAE100-48S24W HAE100-48S24W P-DUKE Technology hae100w_datasheet.pdf Description: DC DC CONVERTER 24V 101W
Packaging: Bulk
Features: Adjustable Output, Baseplate, Remote On/Off, Remote Sense
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C (With Derating)
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 4.2A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 24V
Control Features: Enable, Active Low
Part Status: Active
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
Standard Number: 60950-1
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+244.38 EUR
AR 08-HZW/TN AR 08-HZW/TN Assmann WSW Components ASS_6290_CO.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.43 EUR
10+ 2.1 EUR
25+ 2.01 EUR
60+ 1.97 EUR
120+ 1.88 EUR
Mindestbestellmenge: 8
AR 14-HZW/TN AR 14-HZW/TN Assmann WSW Components ASS_6290_CO.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 2798 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.24 EUR
10+ 3.69 EUR
34+ 3.53 EUR
68+ 3.45 EUR
102+ 3.3 EUR
272+ 2.98 EUR
510+ 2.75 EUR
1020+ 2.35 EUR
2516+ 2.2 EUR
Mindestbestellmenge: 5
AR 16-HZW/TN AR 16-HZW/TN Assmann WSW Components ASS_6290_CO.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.49 EUR
10+ 4.07 EUR
Mindestbestellmenge: 4
AR 28-HZL/07-TT AR 28-HZL/07-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.49 EUR
Mindestbestellmenge: 3
DSC1001AE1-004.0000 DSC1001AE1-004.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1001AE1-004.0000T DSC1001AE1-004.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1001AE1-004.0000T DSC1001AE1-004.0000T Microchip Technology DSC1001_3_4_1_8V_3_3V_Low_Power_Precision_CMOS_Osc-3314582.pdf Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
Produkt ist nicht verfügbar
DSC1121AE1-004.0000 DSC1121AE1-004.0000 Microchip Technology Description: MEMS OSCILLATOR LOW JITTER
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1121AE1-004.0000 DSC1121AE1-004.0000 Microchip Technology DSC1101_21_Low_Jitter_Precision_CMOS_Oscillator_DS-3314635.pdf Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
DSC1121AE1-004.0000T DSC1121AE1-004.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSCILLATOR LOW JITTER
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1121AE1-004.0000T DSC1121AE1-004.0000T Microchip Technology DSC1101_21_Low_Jitter_Precision_CMOS_Oscillator_DS-3314635.pdf Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
Si5386A-E10044-GM Si5386A-E10044-GM Skyworks Solutions, Inc. si5386_datasheet-2507566.pdf Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
Si5386A-E10044-GMR Si5386A-E10044-GMR Skyworks Solutions, Inc. si5386_datasheet-2507566.pdf Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
AK140-2 AK140-2 Assmann WSW Components Description: CABLE CENTRONICS M-F 2M
Packaging: Bag
Length: 6.56' (2.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
Produkt ist nicht verfügbar
AR 18-HZW/TN AR 18-HZW/TN Assmann WSW Components ASS_6290_CO.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 24-HZL/07/7-TT AR 24-HZL/07/7-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 28-HZL/07/7-TT AR 28-HZL/07/7-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 32-HZL/07-TT AR 32-HZL/07-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 40-HZL/07-TT AR 40-HZL/07-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 48-HZL/07-TT AR 48-HZL/07-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
DSC1001AE1-004.0000 DSC1001_3_4_1_8V_3_3V_Low_Power_Precision_CMOS_Osc-3314582.pdf
DSC1001AE1-004.0000
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
auf Bestellung 868 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+1.81 EUR
Mindestbestellmenge: 2
DSC1001AE1-004.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AE1-004.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.5mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+2.18 EUR
25+ 1.81 EUR
100+ 1.75 EUR
Mindestbestellmenge: 9
HAE100-48S12W hae100w_datasheet.pdf
HAE100-48S12W
Hersteller: P-DUKE Technology
Description: DC DC CONVERTER 12V 101W
Packaging: Box
Features: Adjustable Output, Remote On/Off, Remote Sense
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 8.4A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 12V
Control Features: Enable, Active Low
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+244.38 EUR
HAE100-48S24W hae100w_datasheet.pdf
HAE100-48S24W
Hersteller: P-DUKE Technology
Description: DC DC CONVERTER 24V 101W
Packaging: Bulk
Features: Adjustable Output, Baseplate, Remote On/Off, Remote Sense
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C (With Derating)
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 4.2A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 24V
Control Features: Enable, Active Low
Part Status: Active
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
Standard Number: 60950-1
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+244.38 EUR
AR 08-HZW/TN ASS_6290_CO.pdf
AR 08-HZW/TN
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.43 EUR
10+ 2.1 EUR
25+ 2.01 EUR
60+ 1.97 EUR
120+ 1.88 EUR
Mindestbestellmenge: 8
AR 14-HZW/TN ASS_6290_CO.pdf
AR 14-HZW/TN
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 2798 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.24 EUR
10+ 3.69 EUR
34+ 3.53 EUR
68+ 3.45 EUR
102+ 3.3 EUR
272+ 2.98 EUR
510+ 2.75 EUR
1020+ 2.35 EUR
2516+ 2.2 EUR
Mindestbestellmenge: 5
AR 16-HZW/TN ASS_6290_CO.pdf
AR 16-HZW/TN
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.49 EUR
10+ 4.07 EUR
Mindestbestellmenge: 4
AR 28-HZL/07-TT ASS_4852_CO.pdf
AR 28-HZL/07-TT
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.49 EUR
Mindestbestellmenge: 3
DSC1001AE1-004.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AE1-004.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1001AE1-004.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AE1-004.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1001AE1-004.0000T DSC1001_3_4_1_8V_3_3V_Low_Power_Precision_CMOS_Osc-3314582.pdf
DSC1001AE1-004.0000T
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
Produkt ist nicht verfügbar
DSC1121AE1-004.0000
DSC1121AE1-004.0000
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR LOW JITTER
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1121AE1-004.0000 DSC1101_21_Low_Jitter_Precision_CMOS_Oscillator_DS-3314635.pdf
DSC1121AE1-004.0000
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
DSC1121AE1-004.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121AE1-004.0000T
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR LOW JITTER
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1121AE1-004.0000T DSC1101_21_Low_Jitter_Precision_CMOS_Oscillator_DS-3314635.pdf
DSC1121AE1-004.0000T
Hersteller: Microchip Technology
Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
Produkt ist nicht verfügbar
Si5386A-E10044-GM si5386_datasheet-2507566.pdf
Si5386A-E10044-GM
Hersteller: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
Si5386A-E10044-GMR si5386_datasheet-2507566.pdf
Si5386A-E10044-GMR
Hersteller: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Produkt ist nicht verfügbar
AK140-2
AK140-2
Hersteller: Assmann WSW Components
Description: CABLE CENTRONICS M-F 2M
Packaging: Bag
Length: 6.56' (2.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
Produkt ist nicht verfügbar
AR 18-HZW/TN ASS_6290_CO.pdf
AR 18-HZW/TN
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 24-HZL/07/7-TT ASS_4852_CO.pdf
AR 24-HZL/07/7-TT
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 28-HZL/07/7-TT ASS_4852_CO.pdf
AR 28-HZL/07/7-TT
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 32-HZL/07-TT ASS_4852_CO.pdf
AR 32-HZL/07-TT
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 40-HZL/07-TT ASS_4852_CO.pdf
AR 40-HZL/07-TT
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
AR 48-HZL/07-TT ASS_4852_CO.pdf
AR 48-HZL/07-TT
Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar