Produkte > EPCOS - TDK ELECTRONICS > B32656S8255J561

B32656S8255J561 EPCOS - TDK Electronics


MKP_B32656S.pdf
Hersteller: EPCOS - TDK Electronics
Description: CAP FILM 2.5UF 5% 850VDC SCREW
Size / Dimension: 1.654" L x 1.181" W (42.00mm x 30.00mm)
Capacitance: 2.5 µF
Height - Seated (Max): 1.772" (45.00mm)
Voltage Rating - DC: 850V
Voltage Rating - AC: 450V
Dielectric Material: Polypropylene (PP), Metallized
Termination: Screw Terminals
Lead Spacing: 1.102" (28.00mm)
Applications: Snubber
Operating Temperature: -55°C ~ 100°C
Mounting Type: Chassis Mount
Package / Case: Rectangular Box
Features: Low ESL
Tolerance: ±5%
Packaging: Bulk
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Technische Details B32656S8255J561 EPCOS - TDK Electronics

Description: CAP FILM 2.5UF 5% 850VDC SCREW, Size / Dimension: 1.654" L x 1.181" W (42.00mm x 30.00mm), Capacitance: 2.5 µF, Height - Seated (Max): 1.772" (45.00mm), Voltage Rating - DC: 850V, Voltage Rating - AC: 450V, Dielectric Material: Polypropylene (PP), Metallized, Termination: Screw Terminals, Lead Spacing: 1.102" (28.00mm), Applications: Snubber, Operating Temperature: -55°C ~ 100°C, Mounting Type: Chassis Mount, Package / Case: Rectangular Box, Features: Low ESL, Tolerance: ±5%, Packaging: Bulk.