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B32923C3154M000

B32923C3154M000 TDK


x2_b32921_928.pdf Hersteller: TDK
Description: CAP FILM 0.15UF 20% 630VDC RAD
Tolerance: ±20%
Packaging: Bulk
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 110°C
Applications: EMI, RFI Suppression
Lead Spacing: 0.886" (22.50mm)
Termination: PC Pins
Ratings: X2
Dielectric Material: Polypropylene (PP)
Voltage Rating - AC: 305V
Voltage Rating - DC: 630V
Part Status: Active
Capacitance: 0.15 µF
auf Bestellung 5421 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+1.27 EUR
22+0.8 EUR
50+0.62 EUR
100+0.57 EUR
720+0.46 EUR
1440+0.43 EUR
2880+0.41 EUR
5040+0.39 EUR
Mindestbestellmenge: 14
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Technische Details B32923C3154M000 TDK

Description: CAP FILM 0.15UF 20% 630VDC RAD, Tolerance: ±20%, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 0.886" (22.50mm), Termination: PC Pins, Ratings: X2, Dielectric Material: Polypropylene (PP), Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Part Status: Active, Capacitance: 0.15 µF.