B32923C3154M000 TDK
Hersteller: TDK
Description: CAP FILM 0.15UF 20% 630VDC RAD
Tolerance: ±20%
Packaging: Bulk
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 110°C
Applications: EMI, RFI Suppression
Lead Spacing: 0.886" (22.50mm)
Termination: PC Pins
Ratings: X2
Dielectric Material: Polypropylene (PP)
Voltage Rating - AC: 305V
Voltage Rating - DC: 630V
Part Status: Active
Capacitance: 0.15 µF
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.63 EUR |
| 21+ | 1.04 EUR |
| 50+ | 0.8 EUR |
| 100+ | 0.73 EUR |
| 720+ | 0.58 EUR |
| 1440+ | 0.55 EUR |
| 2880+ | 0.52 EUR |
| 5040+ | 0.5 EUR |
Artikel auf Bestellung
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Lieferzeit:
10-14 Tag (e)
Mindestmenge:
13 Stücke
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Technische Details B32923C3154M000 TDK
Description: CAP FILM 0.15UF 20% 630VDC RAD, Tolerance: ±20%, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 0.886" (22.50mm), Termination: PC Pins, Ratings: X2, Dielectric Material: Polypropylene (PP), Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Part Status: Active, Capacitance: 0.15 µF.