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B32924C3275K000

B32924C3275K000 TDK Corporation


x2_b32921_928.pdf Hersteller: TDK Corporation
Description: CAP FILM 2.7UF 10% 630VDC RADIAL
Packaging: Bulk
Tolerance: ±10%
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 110°C
Applications: EMI, RFI Suppression
Lead Spacing: 1.083" (27.50mm)
Termination: PC Pins
Ratings: X2
Dielectric Material: Polypropylene (PP), Metallized
Voltage Rating - AC: 305V
Voltage Rating - DC: 630V
Part Status: Active
Capacitance: 2.7 µF
auf Bestellung 652 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.13 EUR
10+2.13 EUR
50+1.74 EUR
200+1.51 EUR
600+1.39 EUR
Mindestbestellmenge: 6
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Technische Details B32924C3275K000 TDK Corporation

Description: CAP FILM 2.7UF 10% 630VDC RADIAL, Packaging: Bulk, Tolerance: ±10%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 1.083" (27.50mm), Termination: PC Pins, Ratings: X2, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Part Status: Active, Capacitance: 2.7 µF.