BC57G687C-INN-E4 Qualcomm
Hersteller: Qualcomm
Description: IC RF TXRX+MCU BLUTOOTH 105LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 105-LFBGA
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 16MB Flash, 48kB RAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v2.1 +EDR, Class 2 and 3
Current - Receiving: 45mA
Current - Transmitting: 45mA
Supplier Device Package: 105-LFBGA (10x10)
RF Family/Standard: Bluetooth
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLUTOOTH 105LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 105-LFBGA
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 16MB Flash, 48kB RAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v2.1 +EDR, Class 2 and 3
Current - Receiving: 45mA
Current - Transmitting: 45mA
Supplier Device Package: 105-LFBGA (10x10)
RF Family/Standard: Bluetooth
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details BC57G687C-INN-E4 Qualcomm
Description: IC RF TXRX+MCU BLUTOOTH 105LFBGA, Packaging: Tape & Reel (TR), Package / Case: 105-LFBGA, Sensitivity: -90dBm, Mounting Type: Surface Mount, Frequency: 2.4GHz, Memory Size: 16MB Flash, 48kB RAM, Type: TxRx + MCU, Operating Temperature: -30°C ~ 85°C, Voltage - Supply: 1.8V ~ 3.6V, Power - Output: 5dBm, Protocol: Bluetooth v2.1 +EDR, Class 2 and 3, Current - Receiving: 45mA, Current - Transmitting: 45mA, Supplier Device Package: 105-LFBGA (10x10), RF Family/Standard: Bluetooth, Part Status: Obsolete, DigiKey Programmable: Not Verified.