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CYT3DLBBEBQ1BZSGS

CYT3DLBBEBQ1BZSGS Infineon Technologies


Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4.063MB FLSH 272BGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.063MB (4.063M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: DMA, I2S, LVD, Temp Sensor, WDT
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Supplier Device Package: 272-BGA (16x16)
Number of I/O: 135
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+59.44 EUR
10+48.32 EUR
25+45.55 EUR
96+42.58 EUR
288+40.86 EUR
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Technische Details CYT3DLBBEBQ1BZSGS Infineon Technologies

Description: IC MCU 32BIT 4.063MB FLSH 272BGA, Packaging: Tray, Package / Case: 272-LFBGA, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 4.063MB (4.063M x 8), RAM Size: 384K x 8, Operating Temperature: -40°C ~ 105°C (TA), Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: DMA, I2S, LVD, Temp Sensor, WDT, Peripherals: DMA, I2S, LVD, Temp Sensor, WDT, Supplier Device Package: 272-BGA (16x16), Number of I/O: 135, DigiKey Programmable: Not Verified.