CYT3DLBBEBQ1BZSGS Infineon Technologies
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4.063MB FLSH 272BGA
DigiKey Programmable: Not Verified
Number of I/O: 135
Supplier Device Package: 272-BGA (16x16)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: DMA, I2S, LVD, Temp Sensor, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 4.063MB (4.063M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 272-LFBGA
Packaging: Tray
| Anzahl | Preis |
|---|---|
| 1+ | 59.44 EUR |
| 10+ | 48.32 EUR |
| 25+ | 45.55 EUR |
| 96+ | 42.58 EUR |
| 288+ | 40.86 EUR |
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Technische Details CYT3DLBBEBQ1BZSGS Infineon Technologies
Description: IC MCU 32BIT 4.063MB FLSH 272BGA, DigiKey Programmable: Not Verified, Number of I/O: 135, Supplier Device Package: 272-BGA (16x16), Peripherals: DMA, I2S, LVD, Temp Sensor, WDT, Connectivity: DMA, I2S, LVD, Temp Sensor, WDT, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Core Size: 32-Bit Dual-Core, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, EEPROM Size: 128K x 8, Program Memory Type: FLASH, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 384K x 8, Program Memory Size: 4.063MB (4.063M x 8), Speed: 240MHz, Mounting Type: Surface Mount, Package / Case: 272-LFBGA, Packaging: Tray.