DIP328-014BLF Amphenol ICC (FCI)

Description: CONN IC DIP SOCKET 28POS TIN, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bag, Part Status: Obsolete, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.