Produkte > SAMTEC INC. > ESQ-110-12-G-D-LL-014

ESQ-110-12-G-D-LL-014 Samtec Inc.


esq_th.pdf Hersteller: Samtec Inc.
Description: CONN SOCKET 20POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: 19
Termination: Kinked Pin, Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.435" (11.05mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Produkt ist nicht verfügbar

Produktrezensionen
Produktbewertung abgeben

Technische Details ESQ-110-12-G-D-LL-014 Samtec Inc.

Description: CONN SOCKET 20POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.7A per Contact, Mounting Type: Through Hole, Number of Positions: 20, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: 19, Termination: Kinked Pin, Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Gold, Contact Length - Post: 0.090" (2.29mm), Insulation Height: 0.435" (11.05mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.