Technische Details ESQ-119-33-G-D-LL Samtec
Description: CONN SOCKET 38POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.7A per Contact, Mounting Type: Through Hole, Number of Positions: 38, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Kinked Pin, Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Gold, Contact Length - Post: 0.090" (2.29mm), Insulation Height: 0.635" (16.13mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote ESQ-119-33-G-D-LL
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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ESQ-119-33-G-D-LL | Hersteller : Samtec Inc. |
![]() Packaging: Bulk Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.7A per Contact Mounting Type: Through Hole Number of Positions: 38 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Kinked Pin, Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Contact Length - Post: 0.090" (2.29mm) Insulation Height: 0.635" (16.13mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
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