GS 66 P FISCHER ELEKTRONIK
Hersteller: FISCHER ELEKTRONIK
Category: Heatsinks - equipment
Description: Heat transfer pad: mica; TO66; 0.4K/W; L: 18mm; W: 13.5mm
Type of heat transfer pad: mica
Application: TO66
Thermal resistance: 0.4K/W
Length: 18mm
Width: 13.5mm
Thickness: 50µm
Mounting hole diameter: 3.7mm
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Technische Details GS 66 P FISCHER ELEKTRONIK
Category: Heatsinks - equipment, Description: Heat transfer pad: mica; TO66; 0.4K/W; L: 18mm; W: 13.5mm, Type of heat transfer pad: mica, Application: TO66, Thermal resistance: 0.4K/W, Length: 18mm, Width: 13.5mm, Thickness: 50µm, Mounting hole diameter: 3.7mm.

