HFC03-6N2S-RC Allied Components International
Hersteller: Allied Components InternationalDescription: 6.2NH 0.3NH 0402 HI-FREQ CHIP
Tolerance: ±0.3nH
Packaging: Tape & Reel (TR)
Package / Case: 0402 (1005 Metric)
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Operating Temperature: -55°C ~ 125°C
DC Resistance (DCR): 250mOhm Max
Q @ Freq: 11 @ 100MHz
Frequency - Self Resonant: 4.55GHz
Current - Saturation (Isat): 400mA
Material - Core: Ceramic
Inductance Frequency - Test: 100 MHz
Supplier Device Package: 0402
Height - Seated (Max): 0.024" (0.60mm)
Inductance: 6.2 nH
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 12+ | 1.93 EUR |
| 13+ | 1.83 EUR |
| 15+ | 1.73 EUR |
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Technische Details HFC03-6N2S-RC Allied Components International
Description: 6.2NH 0.3NH 0402 HI-FREQ CHIP, Tolerance: ±0.3nH, Packaging: Tape & Reel (TR), Package / Case: 0402 (1005 Metric), Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm), Mounting Type: Surface Mount, Shielding: Unshielded, Operating Temperature: -55°C ~ 125°C, DC Resistance (DCR): 250mOhm Max, Q @ Freq: 11 @ 100MHz, Frequency - Self Resonant: 4.55GHz, Current - Saturation (Isat): 400mA, Material - Core: Ceramic, Inductance Frequency - Test: 100 MHz, Supplier Device Package: 0402, Height - Seated (Max): 0.024" (0.60mm), Inductance: 6.2 nH.