HSEC1-030-01-L-DV-WT-TR Samtec Inc.
Hersteller: Samtec Inc.Description: 1.00 MM EDGE RATE HIGH-SPEED EDG
Features: Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.039" (1.00mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Phosphor Bronze
Number of Positions/Bay/Row: 30
Number of Rows: 2
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Technische Details HSEC1-030-01-L-DV-WT-TR Samtec Inc.
Description: 1.00 MM EDGE RATE HIGH-SPEED EDG, Features: Solder Retention, Packaging: Tape & Reel (TR), Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.039" (1.00mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 10.0µin (0.25µm), Contact Material: Phosphor Bronze, Number of Positions/Bay/Row: 30, Number of Rows: 2.