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HSS15-B20-P40

HSS15-B20-P40 CUI Devices

hss15-b20-p40.pdf Hersteller: CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 23.
Packaging: Box
Material: Aluminum Alloy
Length: 1.500" (38.10mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.921" (23.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.16°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 4826 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11+1.64 EUR
12+ 1.57 EUR
25+ 1.49 EUR
50+ 1.45 EUR
100+ 1.43 EUR
250+ 1.33 EUR
500+ 1.25 EUR
1000+ 1.14 EUR
Mindestbestellmenge: 11
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Produktbewertung abgeben

Technische Details HSS15-B20-P40 CUI Devices

Description: HEAT SINK, STAMPING, TO-220, 23., Packaging: Box, Material: Aluminum Alloy, Length: 1.500" (38.10mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 0.921" (23.40mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 5.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 8.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.16°C/W, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized, Part Status: Active.