Produkte > SAMTEC INC. > HTSW-113-08-SS-D-RA
HTSW-113-08-SS-D-RA

HTSW-113-08-SS-D-RA Samtec Inc.


Hersteller: Samtec Inc.
Description: CONN HEADER R/A 26POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole, Right Angle
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.240" (6.10mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
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Technische Details HTSW-113-08-SS-D-RA Samtec Inc.

Description: CONN HEADER R/A 26POS 2.54MM, Packaging: Bulk, Connector Type: Header, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Through Hole, Right Angle, Number of Positions: 26, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Shape: Square, Contact Length - Post: 0.090" (2.29mm), Insulation Height: 0.240" (6.10mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).