MBC50-3B12 MACOM Technology Solutions
Hersteller: MACOM Technology Solutions
Description: CAP SILICON 3PF 20% 50V SMD
Packaging: Tray
Tolerance: ±20%
Package / Case: Nonstandard Chip
Size / Dimension: 1.417" L x 0.512" W (36.00mm x 13.00mm)
Operating Temperature: -55°C ~ 200°C
Height: 0.179" (4.55mm)
Applications: High Stability
Part Status: Active
Capacitance: 3 pF
Voltage - Breakdown: 50 V
Description: CAP SILICON 3PF 20% 50V SMD
Packaging: Tray
Tolerance: ±20%
Package / Case: Nonstandard Chip
Size / Dimension: 1.417" L x 0.512" W (36.00mm x 13.00mm)
Operating Temperature: -55°C ~ 200°C
Height: 0.179" (4.55mm)
Applications: High Stability
Part Status: Active
Capacitance: 3 pF
Voltage - Breakdown: 50 V
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
50+ | 12.01 EUR |
100+ | 10.43 EUR |
250+ | 9.96 EUR |
500+ | 9.08 EUR |
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Technische Details MBC50-3B12 MACOM Technology Solutions
Description: CAP SILICON 3PF 20% 50V SMD, Packaging: Tray, Tolerance: ±20%, Package / Case: Nonstandard Chip, Size / Dimension: 1.417" L x 0.512" W (36.00mm x 13.00mm), Operating Temperature: -55°C ~ 200°C, Height: 0.179" (4.55mm), Applications: High Stability, Part Status: Active, Capacitance: 3 pF, Voltage - Breakdown: 50 V.