MCI0603TM2N2BHBPDG INPAQ Technology Co., Ltd
Hersteller: INPAQ Technology Co., LtdDescription: FIXED IND 0603 2.2NH 600MA 0.15O
Packaging: Cut Tape (CT)
Tolerance: ±0.1nH
Package / Case: 0201 (0603 Metric)
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Multilayer
Operating Temperature: -55°C ~ 125°C
DC Resistance (DCR): 150mOhm Max
Q @ Freq: 14 @ 500MHz
Frequency - Self Resonant: 11GHz
Material - Core: Ceramic
Inductance Frequency - Test: 500 MHz
Supplier Device Package: 0201
Height - Seated (Max): 0.013" (0.33mm)
Inductance: 2.2 nH
Current Rating (Amps): 600 mA
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Technische Details MCI0603TM2N2BHBPDG INPAQ Technology Co., Ltd
Description: FIXED IND 0603 2.2NH 600MA 0.15O, Packaging: Cut Tape (CT), Tolerance: ±0.1nH, Package / Case: 0201 (0603 Metric), Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Multilayer, Operating Temperature: -55°C ~ 125°C, DC Resistance (DCR): 150mOhm Max, Q @ Freq: 14 @ 500MHz, Frequency - Self Resonant: 11GHz, Material - Core: Ceramic, Inductance Frequency - Test: 500 MHz, Supplier Device Package: 0201, Height - Seated (Max): 0.013" (0.33mm), Inductance: 2.2 nH, Current Rating (Amps): 600 mA.