MDM-9SBSP-T ITT Industries
Hersteller: ITT IndustriesConn Micro D-Subminiature SKT 9 POS Solder ST Thru-Hole 9 Terminal 1 Port
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Technische Details MDM-9SBSP-T ITT Industries
Description: CONN MICRO-D RCPT 9P PNL MNT SLD, Features: Shielded, Packaging: Bulk, Connector Type: Receptacle, Female Sockets, Contact Finish: Gold, Current Rating (Amps): 3A, Mounting Type: Panel Mount, Through Hole, Number of Positions: 9, Number of Rows: 2, Contact Type: Signal, Flange Feature: Mating Side, Female Screwlock (2-56), Termination: Solder, Connector Style: D-Type, Micro-D, Shell Material, Finish: Aluminum, Yellow Chromate Plated Cadmium, Shell Size, Connector Layout: 0.050 Pitch x 0.100 Row to Row.
Weitere Produktangebote MDM-9SBSP-T
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| MDM-9SBSPT | Hersteller : ITT Cannon, LLC |
Description: CONN MICRO-D RCPT 9P PNL MNT SLD Features: Shielded Packaging: Bulk Connector Type: Receptacle, Female Sockets Contact Finish: Gold Current Rating (Amps): 3A Mounting Type: Panel Mount, Through Hole Number of Positions: 9 Number of Rows: 2 Contact Type: Signal Flange Feature: Mating Side, Female Screwlock (2-56) Termination: Solder Connector Style: D-Type, Micro-D Shell Material, Finish: Aluminum, Yellow Chromate Plated Cadmium Shell Size, Connector Layout: 0.050 Pitch x 0.100 Row to Row |
Produkt ist nicht verfügbar |