NC2SWLF.020 1LB Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 105.51 EUR |
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Technische Details NC2SWLF.020 1LB Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP, Packaging: Bulk, Diameter: 0.020" (0.51mm), Wire Gauge: 24 AWG, 25 SWG, Composition: Sn99.3Cu0.7 (99.3/0.7), Type: Wire Solder, Melting Point: 441°F (227°C), Form: Spool, 1 lb (454 g), Process: Lead Free, Flux Type: No-Clean, Part Status: Active.