NC2SWLF.031 1LB Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 86.28 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details NC2SWLF.031 1LB Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 21 SWG, Composition: Sn99.3Cu0.7 (99.3/0.7), Type: Wire Solder, Melting Point: 441°F (227°C), Form: Spool, 1 lb (454 g), Process: Lead Free, Flux Type: No-Clean.