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NC3SW.031 1LB

NC3SW.031 1LB Chip Quik Inc.


NC3SW.031 1LB.pdf Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
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Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+124.48 EUR
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Technische Details NC3SW.031 1LB Chip Quik Inc.

Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 21 SWG, Composition: Sn62Pb36Ag2 (62/36/2), Type: Wire Solder, Melting Point: 354°F (179°C), Form: Spool, 1 lb (454 g), Process: Leaded, Flux Type: No-Clean, Part Status: Active.